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浏览/检索结果: 共5条，第1-5条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin 收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16 Additives  Atomic force microscopy  Binary alloys  Chlorine compounds  Copper  Copper compounds  Electron probe microanalysis  Electrons  High resolution transmission electron microscopy  Metallic films  Scanning electron microscopy  Tin alloys  Tin metallography  X ray photoelectron spectroscopy  Crystallographic orientations  Electron back scatter diffraction  Electroplated copper film  Electroplated Cu films  Impurity incorporation  Micro-structural characterization  Microstructural instability  Plating solutions   Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Binary alloys  Geometry  Intermetallics  Lead-free solders  Morphology  Polychlorinated biphenyls  Silver compounds  Soldered joints  Tin alloys  Aging time  Compressive strain  Enhanced effects  Growth of intermetallics  Kirkendall void  Mean diameter  Polyhedron shapes  Solder joints   Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420 作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin;  Zhou, Liuru 收藏  |  浏览/下载：8/0  |  提交时间：2019/11/15 Study of cone NC sheet metal incremental forming (EI收录) 会议论文 2011 2nd International Conference on Mechanic Automation and Control Engineering, MACE 2011 - Proceedings, Inner Mongolia, China, July 15, 2011 - July 17, 2011 作者:  Zhou, Liuru[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Deformation  Experiments  Metal forming  Metals   Study on change law of the inner texture of the square truncated cone in NC incremental forming (EI收录) 会议论文 2011 2nd International Conference on Mechanic Automation and Control Engineering, MACE 2011 - Proceedings, Inner Mongolia, China, July 15, 2011 - July 17, 2011 作者:  Zhou, Liuru[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Crystalline materials  Deformation  Experiments  Metal forming  Metals  Textures