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科研机构
华南理工大学 [5]
重庆大学 [1]
上海大学 [1]
内容类型
会议 [3]
会议论文 [2]
期刊论文 [2]
发表日期
2015 [2]
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Methanolysis of ammonia borane by shape-controlled mesoporous copper nanostructures for hydrogen generation
期刊论文
2015, 卷号: 44, 页码: 1070-1076
作者:
Yao, Qilu[1]
;
Huang, Ming[2]
;
Lu, Zhang-Hui[1]
;
Yang, Yuwen[1]
;
Zhang, Yuxin[2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/30
Experimental and phenomenological investigations of diffusion in Co-Al-W alloys
期刊论文
SCRIPTA MATERIALIA, 2015, 卷号: 106, 页码: 13-16
作者:
Chang, Hui[1]
;
Xu, Guanglong[2]
;
Lu, Xiao-Gang[3]
;
Zhou, Lian[4]
;
Ishida, Kiyohito[5]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/26
Co-Al-W
Bulk diffusion
Electron probe microanalysis (EPMA)
Modelling
Phenomenological treatment
Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录)
会议
作者:
Jiang, Han[1]
;
Liang, Shui-Bao[1]
;
Yuwen, Hui-Hui[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
TSV
solder bump joint
thermal fatigue
size effect
finite element analysis
Numerical simulation of the TSV-Cu filling by electroplating process with the accelerator and suppressor (CPCI-S收录)
会议
作者:
Yuwen, Hui-Hui[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
TSV
Cu electroplating
finite element simulation
surface coverage
local current density distribution
The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array (CPCI-S收录)
会议
作者:
Yuwen, Hui-Hui[1]
;
Qin, Hong-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
TSV
Cu-Cu interconnect
thermo-mechanical reliability
keep-away-zone
finite element method
Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via str (EI收录)
会议论文
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013
作者:
Qin, Hong-Bo[1]
;
Yuwen, Hui-Hui[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/15
Electronics packaging
Finite element method
Thermal cycling
Thermal stress
Three dimensional
Influence of Geometry of Microbump Interconnects on Thermal Stress and Fatigue Life of Interconnects in Copper Filled Through Silicon Via Str (CPCI-S收录)
会议论文
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
作者:
Qin, Hong-Bo[1]
;
Yuwen, Hui-Hui[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/15
TSV
3D packaging
microbump interconnect
fatigue life
finite element simulation
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