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CORC

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Swarm Intelligence-Inspired Spontaneous Fabrication of Optimal Interconnect at the Micro/Nanoscale 期刊论文
ADVANCED MATERIALS, 2017, 卷号: 29, 期号: 7
作者:  Su, Meng;  Huang, Zhandong;  Huang, Yong;  Chen, Shuoran;  Qian, Xin
收藏  |  浏览/下载：23/0  |  提交时间：2019/04/09
A Robust Energy/Area-Efficient Forwarded-Clock Receiver With All-Digital Clock and Data Recovery in 28-nm CMOS for High-Density Interconnects 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 卷号: 24, 期号: 2, 页码: 578-586
作者:  Chen, Shuai;  Li, Hao;  Chiang, Patrick Yin
收藏  |  浏览/下载：21/0  |  提交时间：2019/12/13
A Robust Energy/Area-Efficient Forwarded-Clock Receiver With All-Digital Clock and Data Recovery in 28-nm CMOS for High-Density Interconnects 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2016, 卷号: 24, 期号: 2
作者:  Chen, Shuai;  Li, Hao;  Chiang, Patrick Yin
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/13
Interconnect delay optimization for deep submicron technology 期刊论文
Hunan Daxue Xuebao/Journal of Hunan University Natural Sciences, 2015, 卷号: Vol.42 No.4, 页码: 85-92
作者:  Li, Ren-Fa;  Xu, Shi;  Zhao, Zhen-Yu;  Wang, Yao;  Liu, Chang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31
Flexible logic circuits based on top-gate thin film transistors with printed semiconductor carbon nanotubes and top electrodes 期刊论文
NANOSCALE, 2014, 卷号: 6, 期号: 24, 页码: 14891-14897
作者:  Gu, WB (顾唯兵);  Cui, Z (崔铮)
收藏  |  浏览/下载：31/0  |  提交时间：2015/02/03
Statistical Assessment Methodology for the Design and Optimization of Cross-Point RRAM Arrays 其他
2014-01-01
Li, Haitong; Jiang, Zizhen; Huang, Peng; Chen, Hong-Yu; Chen, Bing; Liu, Rui; Chen, Zhe; Zhang, Feifei; Liu, Lifeng; Gao, Bin; Liu, Xiaoyan; Yu, Shimeng; Wong, H.S. Philip; Kang, Jinfeng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13
A comprehensive speed-power analysis of resistive switching memory arrays with selection devices 其他
2014-01-01
Li, Haitong; Huang, Peng; Chen, Zhe; Chen, Bing; Gao, Bin; Liu, Lifeng; Liu, Xiaoyan; Kang, Jinfeng
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
Preliminary validation of entransy-based thermal management for 3D IC 其他
2013-01-01
Pi, Yudan; Sun, Han; Huang, Jie; Wang, Wei; Chen, Jing; Jin, Yufeng; Cao, Bingyang
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/13
THE INVESTIGATION OF 3D EMBEDDED MICROCHANNEL NETWORKS FOR 3D IC COOLING, VACUUM PACKAGING AND THZ PASSIVE DEVICE APPLICATIONS 其他
2012-01-01
Miao, Min; Zhang, Jing; Zhang, Yang; Han, Bo; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16
Selected Transition Time Adjustment for Tolerating Crosstalk Effects on Network-on-Chip Interconnects 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2011, 卷号: 19, 期号: 10, 页码: 1787-1800
作者:  Zhang, Ying;  Li, Huawei;  Min, Yinghua;  Li, Xiaowei
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/16

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