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CORC

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Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：16/0  |  提交时间：2022/01/27
Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文
Microelectronics Reliability, 2020, 卷号: 111
作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337
作者:  Ye, Chang-Sheng;  Ci, Wen-Juan;  Lin, Qiao-Li;  Sui, Ran;  Wang, Jian-Bin
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Wetting of amorphous and partial crystalline Co73Si10B17 by Sn and Sn-based lead-free solders 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 98, 页码: 112-118
作者:  Lin, Qiaoli;  Ye, Changsheng;  Sui, Ran;  Ci, Wenjuan
收藏  |  浏览/下载：12/0  |  提交时间：2019/11/15
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Interfacial microstructure evolution of gold alloy/Sn-based solder under different thermal aging conditions 会议论文
2ND INTERNATIONAL WORKSHOP ON MATERIALS SCIENCE AND MECHANICAL ENGINEERING (IWMSME2018), 2019-01-01
作者:  Mu, G. Q.;  Qu, W. Q.;  Wu, Y. C.;  Zhuang, H. S.
收藏  |  浏览/下载：64/0  |  提交时间：2019/12/30
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM
收藏  |  浏览/下载：17/0  |  提交时间：2017/10/27
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
收藏  |  浏览/下载：13/0  |  提交时间：2017/10/27
Ultrasound-assisted soldering of alumina using Ni-foam reinforced Sn-based composite solders 期刊论文
Ceramics International, 2017, 卷号: 43, 期号: 16, 页码: 14314-14320
作者:  Xiao, Yong;  Zhang, Yuanqi;  Zhao, Kai;  Li, Shan;  Wang, Ling
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/04

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