Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain

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	Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain
	Zhang, Q. K.; Hu, F. Q.; Song, Z. L.; Zhang, Z. F.; Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
刊名	ELSEVIER SCIENCE SA
	2017-07-31
卷号	701 页码:187-195
关键词	Viscoplastic Creep In-situ Ebsd Polygonization Grain Boundary Sliding Strain Concentration
ISSN号	0921-5093
英文摘要	In this study, the viscoplastic creep behaviors of the Sn-4Ag/Cu, Sn-3Cu/Cu and Sn-58Bi/Cu solder joints under shear stress were in-situ observed, and the evolutions in microstructure of the solders were characterized by in situ EBSD. The results reveal that the creep strain of the Sn-Cu and Sn-Ag solders increase linearly with increasing time. Deformation of the Sn-Cu solder concentrates in some parallel shear bands, while deformation of the Sn-Ag solder is relatively uniform, and the deformation concentration along the joint interface is not obvious for the two solders. The strain concentration around the fine Ag3Sn particles in the Sn-Ag solder is not obvious, while the strain concentration around the large Cu6Sn5 grain in the Sn-Cu solder is serious and result in fracture of the Cu6Sn5 grain. Dynamic high-temperature recovery occurs in the Sn-Ag and Sn-Cu solders, result in grain boundary migration, polygonization and formation of a few low-angle grain boundaries. The Sn-Bi solder deforms through grain boundary sliding and phase boundary sliding, the strain increase exponentially with increasing time, and its grain structure is stable during the deformation process.; In this study, the viscoplastic creep behaviors of the Sn-4Ag/Cu, Sn-3Cu/Cu and Sn-58Bi/Cu solder joints under shear stress were in-situ observed, and the evolutions in microstructure of the solders were characterized by in situ EBSD. The results reveal that the creep strain of the Sn-Cu and Sn-Ag solders increase linearly with increasing time. Deformation of the Sn-Cu solder concentrates in some parallel shear bands, while deformation of the Sn-Ag solder is relatively uniform, and the deformation concentration along the joint interface is not obvious for the two solders. The strain concentration around the fine Ag3Sn particles in the Sn-Ag solder is not obvious, while the strain concentration around the large Cu6Sn5 grain in the Sn-Cu solder is serious and result in fracture of the Cu6Sn5 grain. Dynamic high-temperature recovery occurs in the Sn-Ag and Sn-Cu solders, result in grain boundary migration, polygonization and formation of a few low-angle grain boundaries. The Sn-Bi solder deforms through grain boundary sliding and phase boundary sliding, the strain increase exponentially with increasing time, and its grain structure is stable during the deformation process.
学科主题	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
语种	英语
资助机构	National Basic Research Program of China [2010CB631006]; Public Projects of Zhejiang Province [2015C31031]
公开日期	2018-01-10
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/79173]
专题	金属研究所_中国科学院金属研究所
通讯作者	Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
推荐引用方式 GB/T 7714	Zhang, Q. K.,Hu, F. Q.,Song, Z. L.,et al. Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain[J]. ELSEVIER SCIENCE SA,2017,701:187-195.
APA	Zhang, Q. K.,Hu, F. Q.,Song, Z. L.,Zhang, Z. F.,&Zhang, QK .(2017).Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain.ELSEVIER SCIENCE SA,701,187-195.
MLA	Zhang, Q. K.,et al."Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain".ELSEVIER SCIENCE SA 701(2017):187-195.