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CORC

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Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：88/0  |  提交时间：2022/07/19
Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337
作者:  Ye, Chang-Sheng;  Ci, Wen-Juan;  Lin, Qiao-Li;  Sui, Ran;  Wang, Jian-Bin
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文
Materials Research Express, 2019, 卷号: 6, 期号: 8
作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14
Electrochemical migration behavior of Sn-based lead-free solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 14695-14702
作者:  Qi, Xiao;  Ma, Haoran;  Wang, Chen;  Shang, Shengyan;  Li, Xiaogan
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Calibration of a Constitutive Model from Tension and Nanoindentation for Lead-Free Solder 期刊论文
MICROMACHINES, 2018, 卷号: 9, 期号: 11, 页码: Ar-608
作者:  Long X;  Zhang XD;  Tang WB;  Wang SB;  Feng YH(冯义辉)
收藏  |  浏览/下载：35/0  |  提交时间：2018/12/12
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 696, 页码: 90-95
作者:  Long X;  Wang SB;  Feng YH(冯义辉);  Yao Y;  Keer LM
收藏  |  浏览/下载：17/0  |  提交时间：2017/10/27
Cooling and Annealing Effect on Indentation Response of Lead-Free Solder 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2017, 卷号: 9, 期号: 4, 页码: 10.1142/S1758825117500570
作者:  Long X;  Feng YH(冯义辉);  Yao Y;  Long, X (reprint author), Northwestern Polytech Univ, Sch Mech Civil Engn & Architecture, Xian 710072, Peoples R China.
收藏  |  浏览/下载：13/0  |  提交时间：2017/10/27
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.
收藏  |  浏览/下载：9/0  |  提交时间：2017/12/25

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