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CORC

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High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate 期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
作者:  Zhang, M.;  Wang, Y. D.;  Xue, P.;  Zhang, H.;  Ni, D. R.
收藏  |  浏览/下载：24/0  |  提交时间：2022/09/16
Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint 期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 14, 页码: 20
作者:  Zhang, Sinan;  Wang Z(王臻);  Wang, Jie;  Duan GH(段桂花);  Li, Haixia
收藏  |  浏览/下载：20/0  |  提交时间：2022/08/22
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Plasma arc welding-brazing of aluminum to copper with SiO2 nanoparticles strengthening 期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2021, 卷号: 69, 页码: 253-260
作者:  Fan, Ding;  Yang, Nan;  Huang, Jiankang;  Yu, Xiaoquan
收藏  |  浏览/下载：3/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：12/0  |  提交时间：2022/02/17
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei
收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文
Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597
作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong
收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14

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