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CORC

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Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 卷号: 14, 期号: 1, 页码: 10-17
作者:  Zhang, Bowen;  Lu, Xinyan;  Ma, Haoxiang;  Wang, Di;  Mei, Yun-Hui
收藏  |  浏览/下载：0/0  |  提交时间：2024/05/07
Strain-tolerant die attach with improved thermal conductivity, and method of fabrication 专利
专利号: US10410958, 申请日期: 2019-09-10, 公开日期: 2019-09-10
作者:  KARLICEK, JR., ROBERT F.
收藏  |  浏览/下载：21/0  |  提交时间：2019/12/24
Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 94, 页码: 46-55
作者:  Zhang, Hongqiang;  Zhao, Zhenyu;  Zou, Guisheng;  Wang, Wengan;  Liu, Lei
收藏  |  浏览/下载：56/0  |  提交时间：2019/12/30
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 774, 页码: 487-494
作者:  Zhang, Hongqiang;  Wang, Wengan;  Bai, Hailin;  Zou, Guisheng;  Liu, Lei
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/30
Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation 期刊论文
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2018, 卷号: 140, 页码: 60-67
作者:  Long X;  Tang WB;  Feng YH(冯义辉);  Chang C;  Keer LM
收藏  |  浏览/下载：35/0  |  提交时间：2018/07/17
Optoelectronic package 专利
专利号: US9899794, 申请日期: 2018-02-20, 公开日期: 2018-02-20
作者:  WONG, WILL KIANG;  PARSA, ROOZBEH;  FRENCH, WILLIAM;  NAKANISHI, NOBORU
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/24
Study on lifetime prediction considering fatigue accumulative effect for die-attach solder layer in an IGBT module 期刊论文
2018, 卷号: 13, 页码: 613-621
作者:  Lai, Wei[1];  Chen, Minyou[1];  Ran, Li[2];  Xu, Shengyou[1];  Pan, Liang-ming[3]
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/28
Uncertainty Quantification for Junction Temperature of Automotive LED With Die-Attach Layer Microstructure 期刊论文
2018, 卷号: 18, 页码: 86-96
作者:  Zhou, Jing[1];  Long, Xingming[2];  He, Jugang[3];  Ren, Fan[3];  Fang, Liang[4]
收藏  |  浏览/下载：10/0  |  提交时间：2019/11/29
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module 期刊论文
2017, 卷号: 32, 页码: 1431-1441
作者:  Lai, Wei[1];  Chen, Minyou[1];  Ran, Li[1,2];  Xu, Shengyou[1];  Jiang, Nan[1]
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/28

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