| Uncertainty Quantification for Junction Temperature of Automotive LED With Die-Attach Layer Microstructure | |
| Zhou, Jing[1]; Long, Xingming[2]; He, Jugang[3]; Ren, Fan[3]; Fang, Liang[4] | |
| 2018 | |
| 卷号 | 18页码:86-96 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3044001 |
| 专题 | 重庆大学 |
| 推荐引用方式 GB/T 7714 | Zhou, Jing[1],Long, Xingming[2],He, Jugang[3],et al. Uncertainty Quantification for Junction Temperature of Automotive LED With Die-Attach Layer Microstructure[J],2018,18:86-96. |
| APA | Zhou, Jing[1],Long, Xingming[2],He, Jugang[3],Ren, Fan[3],&Fang, Liang[4].(2018).Uncertainty Quantification for Junction Temperature of Automotive LED With Die-Attach Layer Microstructure.,18,86-96. |
| MLA | Zhou, Jing[1],et al."Uncertainty Quantification for Junction Temperature of Automotive LED With Die-Attach Layer Microstructure".18(2018):86-96. |
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