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华南理工大学 [17]
内容类型
会议 [17]
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Biochar from Chinese herb residues as adsorbent for toxic metals removal (EI收录)
会议
Bangkok, Thailand,
作者:
Liu, Guocheng[1]
;
Huang, Yu[2]
;
Xu, Lina[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Adsorbents
Cadmium
Cadmium compounds
Chemicals removal (water treatment)
Heavy metals
Lead
Metal ions
Metals
Plants (botany)
The selection of mine tunnel wastewater treatment process and its application effect (EI收录)
会议
作者:
Ma, Bangding[1,2]
;
Chen, Jian[3]
;
Zhao, Wenyu[3]
;
Liu, Kanghuai[3]
;
Chen, Xi[4]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Cadmium
Emission control
Equipment
Filtration
Groundwater
Heavy metals
Investments
Lead
Lead deposits
Ore deposits
Ores
Reclamation
Sewage pumping plants
Water treatment plants
Zinc
Zinc deposits
Zinc mines
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
MEASUREMENTS OF FINE STRUCTURES IN THE LEAD-BISMUTH EUTECTIC ALLOY MELTS BY DIFFERENTIAL SCANNING CALORIMETRY (CPCI-S收录)
会议
作者:
Ye, Changqing[1]
;
Li, Qiulin[1]
;
Wu, Ping[2]
;
Tang, Guoyi[3]
;
Liu, Wei[4]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
lead-bismuth eutectic
differential scanning calorimetry
chemical clusters
Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application (CPCI-S收录)
会议
作者:
Ji, Hongjun[1]
;
Li, Mingyu[1]
;
Qiao, Yunfei[1]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
ultraosnic-assisted soldering
Sn-based lead-free solder
automotive sensors
high power packaging
processes
interconnetion
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Yangtze River: The potential ecological risk of heavy metals in sediment from 1996 to 2012 (EI收录)
会议
Bangkok, Thailand,
作者:
Song, Xinyu[1]
;
Xu, Lina[1]
;
Dai, Yanhui[1]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
Aquatic ecosystems
Cadmium
Copper
Ecology
Engineering research
Heavy metals
Lead
Risk assessment
Rivers
Sediments
Watersheds
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Identifying Lead User in Mass Collaborative Innovation Community: Based on Knowledge Supernetwork (CPCI-S收录)
会议
作者:
Li, Zhihong[1]
;
Tang, Hongting[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Lead user
Knowledge supernetwork
Mass collaborative innovation community
Knowledge management
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
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