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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 3D packaging  Cu6Sn5  regular grains  anisotropy  temperature gradient   Fabrication of embedded piezoelectric sensors and its application in traffic engineering 会议论文 Singapore, Singapore, September 1, 2017 - September 3, 2017 作者:  Zhang, Xingjun;  Song, Shanglin;  Yao, Ming Jie 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15 3D printers  Aggregates  Composite materials  Concrete aggregates  Concrete buildings  Concrete construction  Electric sensing devices  Epoxy resins  Glass ceramics  Highway engineering  Mean square error  Monitoring  Packaging materials  Piezoelectric ceramics  Piezoelectric devices  Piezoelectric transducers  Piezoelectricity  Structural health monitoring  Traffic control  Health monitoring  Piezoelectric sensors  Service performance  Traffic monitoring  Working performance   DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文 China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12 作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02 Hybrid bonding  3D packaging  Bump  Polyimide  Dry film   Research on nano-thermocompression bonding process using nanoporous copper as bonding layer 会议论文 作者:  Li, Kecheng;  Liu, Xiaogang;  Chen, Mingxiang;  Liu, Sheng 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/05 3D packaging  low temperature bonding  nano-thermocompression bonding  nanoporous copper  process optimization   Influence of Geometry of Microbump Interconnects on Thermal Stress and Fatigue Life of Interconnects in Copper Filled Through Silicon Via Str (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Qin, Hong-Bo[1];  Yuwen, Hui-Hui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 TSV  3D packaging  microbump interconnect  fatigue life  finite element simulation