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兰州理工大学 [6]
新疆天文台 [1]
西安光学精密机械研究... [1]
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期刊论文 [5]
会议论文 [3]
发表日期
2020 [8]
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The oxidation effect on the cracking behavior of a Co-based alloy under thermal shocks
期刊论文
Corrosion Science, 2020, 卷号: 173
作者:
Wen, Junxia
;
Cao, Rui
;
Che, Hongyan
;
Dong, Hao
;
Zhang, Haiyan
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Cracks
Electronics packaging
Oxidation
Thermal expansion
Thermal shock
Co-based alloys
Coefficients of thermal expansions
Cracking behavior
Oxidation behaviors
Oxidation effects
Sample surface
Static conditions
Volume change
A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules
会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:
Tian, Jun
;
Wang, Congsi
;
Liu, Shaoyi
;
Zhu, Cheng
;
Zhou, Cheng
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/07/06
Microwave circuits
Belts
Electronics packaging
Flexible electronics
Gold
Integrated circuit interconnects
Microwaves
Timing circuits
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2022/02/17
Binary alloys
Dissolution
Electronics packaging
Energy dispersive spectroscopy
Intermetallics
Lead-free solders
Morphology
Needles
Scanning electron microscopy
Shear flow
Soldered joints
Soldering
Tin
Tin alloys
Tin metallography
Ultrasonic effects
Ultrasonic waves
Uranium metallography
Vanadium metallography
Design/methodology/approach
Dispersion strengthening
Energy dispersive X ray spectroscopy
Fractured surfaces
Grain morphologies
Grooves
Ultrasonic cavitation
Ultrasonic vibration
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
期刊论文
Materials and Design, 2020, 卷号: 188
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/11/14
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shock
Carbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
会议论文
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/12/18
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shockCarbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
High power 250W CW conductively cooled diode laser arrays with low-smile
会议论文
San Francisco, CA, United states, 2020-02-03
作者:
Zhang, Hongyou
;
Zhu, Pengfei
;
Fu, Tuanwei
;
Li, Meiqin
;
Lv, Ning
收藏
  |  
浏览/下载:11/0
  |  
提交时间:2020/05/18
High power
low smile
conductive cooling
packaging technology
Kinetics of dissolution of copper in liquid tin with ultrasonic waves
期刊论文
Materials Research, 2020, 卷号: 23, 期号: 1
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Electronics packaging
Liquids
Tin
Ultrasonic waves
Dissolution behavior
Dissolution rates
Electronic Packaging
IMC layer
Immersion method
Immersion time
Ultrasonic power
Welding method
Kinetics of dissolution of copper in liquid tin with ultrasonic waves
期刊论文
Materials Research, 2020, 卷号: 23, 期号: 1
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2022/02/18
Activation energy
Copper
Electronics packaging
Liquids
Tin
Ultrasonic waves
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