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浏览/检索结果: 共11条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Aggregative growth of quasi-octahedral iron pyrite mesocrystals in a polyol solution through oriented attachment 期刊论文 CRYSTENGCOMM, 2016, 卷号: 18, 页码: 8823-8828 作者:  Xian, Haiyang[1,2,3];  Zhu, Jianxi[1,2];  Tang, Hongmei[1,2,3];  Liang, Xiaoliang[1,2];  He, Hongping[1,2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/24 Quantitative measurement of optical attenuation coefficients of cell lines CNE1, CNE2, and NP69 using optical coherence tomography 期刊论文 LASERS IN MEDICAL SCIENCE, 2013, 卷号: 28, 页码: 621-625 作者:  Li, Jianghua[1];  Tu, Ziwei[2];  Shen, Zhiyuan[3];  Xia, Yunfei[2];  He, Yonghong[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/25 CNE1  CNE2  NP69  Optical coherence tomography (OCT)  Attenuation coefficient   Hermetic Packaging of Kovar Alloy and Low-carbon Steel Structure in Hybrid Integrated Circuit (HIC) System Using Parallel Seam Welding Proces (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Wang, Junde[1];  He, Xiaoqi[1];  Li, Xunping[1];  En, Yunfei[1];  Zhang, Xinping[2] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/12 hermetic packaging  parallel seam welding  microstructure  welding temperature field   Circular polarized incident light scattering properties at optical clearing in tissues (CPCI-S收录) 会议 作者:  Chen, Dongsheng[1,2];  Zeng, Nan[1];  Wang, Yunfei[1,2];  He, Honghui[1];  Tuchin, Valery V.[3,4,5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 circular polarization  scattering  optical clearing   Critical factors on the hermetic characteristics of DC/DC power module (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Li, Xunping[1];  He, Xiaoqi[1];  En, Yunfei[1];  Qi, Guo[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/15 Failure analysis  Finite element method  Glass  Integrated circuits   The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints (EI收录) 会议论文 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, Suzhou, China, July 15, 2013 - July 19, 2013 作者:  Li, Xunping[1];  Bin, Zhou[1];  En, Yunfei[1];  Xiaoqi, He[1];  Wei, Xiongfeng[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Failure analysis  Integrated circuits  Lead  Mechanical properties  Melting point  Microstructure  Silver  Soldered joints  Soldering alloys  Solidification   The Function of IR thermal imaging technology for device and circuit reliability research (CPCI-S收录) 会议论文 2014 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC) 作者:  Song, Fang Fang[1,2];  He, Xiaoqi[2];  En, Yunfei[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/12 IR thermal imaging technology  reliability research  hotspot  peak temperature   Hermetically metal Sealing Random Vibration Damage Mechanism and Fatigue Life Prediction (CPCI-S收录) 会议论文 APPLIED MATERIALS AND TECHNOLOGIES FOR MODERN MANUFACTURING, PTS 1-4 作者:   收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Hermetically metal sealing  damage mechanism  random vibration  fatigue life   Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Weng, Jiancheng[1,2];  Liu, Ganggang[3];  He, Xiaoqi[2];  Zhou, Bin[2];  En, Yunfei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Electronics packaging  Packaging   Failure of flip-chip circuit interconnects under high current density (EI收录) 会议论文 Advanced Materials Research, Shenyang, China, July 28, 2010 - July 30, 2010 作者:  Lu, Yudong[1,2];  He, Xiaoqi[1];  En, Yunfei[1];  Wang, Xin[2];  Zhuang, Zhiqiang[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/16 Atoms  Chemical potential  Chemicals  Current density  Diffusion  Electromigration  Flip chip devices  Lead  Product development  Tin