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科研机构
华南理工大学 [6]
内容类型
会议论文 [5]
期刊论文 [1]
发表日期
2014 [1]
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专题:华南理工大学
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Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation
期刊论文
CMC-COMPUTERS MATERIALS & CONTINUA, 2014, 卷号: 44, 页码: 205-221
作者:
Ou, Zhicheng[1]
;
Yao, Xiaohu[1]
;
Zhang, Xiaoqing[1]
;
Fan, Xuejun[2]
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浏览/下载:3/0
  |  
提交时间:2019/04/25
film
substrate
buckling
large deformation
neo-Hookean
Dynamic growth of voids under effects of thermal and vapor pressure in electronic packaging (EI收录)
会议论文
13th International Conference on Fracture 2013, ICF 2013, Beijing, China, June 16, 2013 - June 21, 2013
作者:
Yao, Xiaohu[1]
;
Mei, Yue[1]
;
Fan, Xuejun[2]
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  |  
浏览/下载:1/0
  |  
提交时间:2019/04/15
Elastic moduli
Electronics packaging
Hydrostatic pressure
Polymers
Vapor pressure
Vapors
Investigation for the Response of PCB Assembly with Five POP Packages during Dropping (CPCI-S收录)
会议论文
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012)
作者:
Yu Peng[1]
;
Fan Zerui[1]
;
Yao Xiaohu[1]
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  |  
浏览/下载:0/0
  |  
提交时间:2019/04/15
Investigation for the response of PCB assembly with five POP packages during dropping (EI收录)
会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:
Yu, Peng[1]
;
Fan, Zerui[1]
;
Yao, Xiaohu[1]
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浏览/下载:1/0
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提交时间:2019/04/15
Computer simulation
Computer software
Electronics packaging
Finite element method
Organic pollutants
Packaging
Polychlorinated biphenyls
Printed circuit manufacture
Research on reliability of board level package-on-package in drop test (EI收录)
会议论文
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010
作者:
Xiaohu, Yao[1]
;
Zerui, Fan[1]
;
Miaomiao, Yuan[1]
;
Xiaoqing, Zhang[1]
;
Zhiqiang, Li[1]
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  |  
浏览/下载:1/0
  |  
提交时间:2019/04/16
Cellular telephone systems
Drops
Electronics packaging
Gages
Impact resistance
Packaging
Printed circuit manufacture
Research
Telecommunication equipment
Research on Reliability of Board Level Package-on-Package in Drop Test (CPCI-S收录)
会议论文
2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP)
作者:
Yao Xiaohu[1]
;
Fan Zerui[1]
;
Yuan Miaomiao[1]
;
Zhang Xiaoqing[1]
;
Li Zhiqiang[1]
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  |  
浏览/下载:0/0
  |  
提交时间:2019/04/16
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