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	Research on reliability of board level package-on-package in drop test (EI收录)
	Xiaohu, Yao[1]; Zerui, Fan[1]; Miaomiao, Yuan[1]; Xiaoqing, Zhang[1]; Zhiqiang, Li[1]; Qiang, Han[1]
会议名称	Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
会议日期	August 16, 2010 - August 19, 2010
会议地点	Xi'an, China
关键词	Cellular telephone systems Drops Electronics packaging Gages Impact resistance Packaging Printed circuit manufacture Research Telecommunication equipment
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2064677
专题	华南理工大学
作者单位	[1] School of Civil Engineering and Transportation, South China University of Technology, Guangzhou 510640, China
推荐引用方式 GB/T 7714	Xiaohu, Yao[1],Zerui, Fan[1],Miaomiao, Yuan[1],等. Research on reliability of board level package-on-package in drop test (EI收录)[C]. 见:Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Xi'an, China. August 16, 2010 - August 19, 2010.

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