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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 High Frequency Analysis and Characterization of TSVs for High-Speed Integrated Systems 其他 2016-01-01 Miao, Min; Fang, Runiu; Sun, Xin; Cui, Xiaole; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 Through silicon via  MOS effect  Noise coupling  SILICON   Optimization of Heat Transfer of Microchannels in LTCC Substrate with Via Holes and Liquid Metal 其他 2016-01-01 Liu, Nian; Jin, Yufeng; Miao, Min; Cui, Xiaole 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 microchannel  LTCC  heat transfer  liquid metal vias holes   Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection 其他 2012-01-01 Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Process Development and Characterization of BCB-based Redistribution Layer (RDL) for Silicon Interposer Application 其他 2012-01-01 Sun, Xin; Cui, Qinghu; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他 2012-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via 其他 2012-01-01 Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Development of a Through-Stack-Via Integrated SRAM Module 其他 2012-01-01 Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16 Process Development of a Stacked Chip Module with TSV Interconnection 其他 2012-01-01 Zhong, Xiao; Ma, Shenglin; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Cui, Qinghu; Miao, Min; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 SILICON  INTEGRATION   Effect of Additives on Copper Electroplating Profile for TSV Filling 其他 2012-01-01 Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Design and process development of a stacked SRAM memory chip module with TSV interconnection 其他 2012-01-01 Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17