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	A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding
	Zhu, Yunhui ; Ma, Shenglin ; Sun, Xin ; Cui, Qinghu ; Zhong, Xiao ; Bian, Yuan ; Chen, Jing ; Miao, Min ; Jin, Yufeng
	2012
英文摘要	In this paper, a TSV last wafer level 3D integration scheme using pre-patterned benzocyclobutene (BCB) adhesive bonding was proposed. With pre-patterned BCB adhesive bonding, a one-time bottom-up TSV filling features as the last step, which eliminates the traditional solder bumping and underfill filling. Preliminary results show that this process is promising for integration of similar chips such as memory chips.; Engineering, Electrical & Electronic; Materials Science, Multidisciplinary; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/ESTC.2012.6542115
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/405923]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zhu, Yunhui,Ma, Shenglin,Sun, Xin,et al. A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding. 2012-01-01.

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