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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Pt-based structured catalysts on metallic supports synthesized by electroless plating deposition for toluene complete oxidation (CPCI-S收录) 会议 作者:  Li, Yongfeng[1,2];  Fan, Yun[1];  Jian, Jianming[1];  Yu, Lin[1];  Cheng, Gao[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Platinum  Electroless plating deposition  Catalytic oxidation  Toluene   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Thermal Environment Dynamic Simulation of Double Skin Facade with Middle Shading Device in Summer (CPCI-S收录) 会议 作者:  Yang, Hua[1];  Zhou, Ying[1];  Jin, Feng-yun[1];  Zhan, Xing[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Double-skin Facade  shading device  CFD  thermal environment   Creep behavior of Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under tensile stress coupled with DC current stressing (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Cu/Sn-3.0Ag-0.5Cu/Cu solder joint  creep behavior  DC current stressing  fracture mode  joint thickness