×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
华南理工大学 [12]
内容类型
会议 [12]
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共12条,第1-10条
帮助
限定条件
内容类型:会议
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
作者升序
作者降序
题名升序
题名降序
发表日期升序
发表日期降序
提交时间升序
提交时间降序
Analysis of baseflow index based hydrological model in Upper Wei River basin on the Loess Plateau in China (EI收录)
会议
Guangzhou, China,
作者:
Liu, Dengfeng[1]
;
Chang, Jianxia[1]
;
Tian, Fuqiang[2]
;
Huang, Qiang[1]
;
Meng, Xianmeng[3]
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/04/11
Arid regions
Climate models
Drought
Groundwater
Hydrology
Landforms
Remote sensing
Rivers
Runoff
Sediments
Soil moisture
Stream flow
Watersheds
A low-dropout regulator with power supply rejection improvement by bandwidth-zero tracking (EI收录)
会议
Ishigaki Island, Okinawa, Japan,
作者:
Lu, Yan[1,2,3]
;
Yao, Ruo He[1]
;
Huang, Da Qiang[1]
;
Su, Julien[1]
;
Jiang, Junmin[2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
CMOS integrated circuits
Voltage regulators
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Reverse Query-Aware Locality-Sensitive Hashing for High-Dimensional Furthest Neighbor Search (CPCI-S收录)
会议
作者:
Huang, Qiang[1]
;
Feng, Jianlin[1]
;
Fang, Qiong[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Comparison of two typhoon-induced storm surges at the Zhanjiang Coast (EI收录)
会议
Kuta, Bali, Indonesia,
作者:
Zhao, Xue[1]
;
Xie, Qiang[2]
;
Hong, Bo[3]
;
Xu, Hongzhou[2]
;
Chen, Lingfang[2]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Atmospheric pressure
Earth sciences
Floods
Geology
Storms
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
Reverse query-Aware locality-sensitive hashing for high-dimensional furthest neighbor search (EI收录)
会议
San Diego, CA, United states,
作者:
Huang, Qiang[1]
;
Feng, Jianlin[1]
;
Fang, Qiong[2]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录)
会议
作者:
Huang, Lia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Sn58Bi
Sn3.0Ag0.5Cu
Mixed solder joint
Microstructure
interfacial reaction
Ball grid array
©版权所有 ©2017 CSpace - Powered by
CSpace