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浏览/检索结果: 共42条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Undercooling and Solidification Behavior of Sn-Ag-Cu Solder Balls and Sn-Ag-Cu/UBM Joints (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Xu, Guang-Sui[1];  Zeng, Jing-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 undercooling  solidification  cooling rate  Sn-Ag-Cu solder ball  Cu/Ni UBM   Interaction Effect between Electromigration and Microstructure Evolution (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Qin, Hong-Bo[1];  Li, Bin[2];  Yue, Wu[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/12 Phase Field Simulation of Solidification Behavior and Microstructure Evolution of Sn-58Bi/Cu Solder Interconnect During Reflow Soldering Proc (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Sn-58Bi/Cu interconnect  Solidification  Undercooling  Dendrite morphology  Phase field simulation   Effect of Activators and Surfactants in Halogen-free Fluxes on Wettability of Sn-0.7Cu-0.05Ni Solder on Cu Substrate (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 activator  surfactant  wettability  halogen-free flux  Sn-0.7Cu-0.05Ni solder   Volume effect on interfacial microstructure and mechanical properties of Ni(UBM)/Sn3.0Ag0.5Cu/Ni(UBM) joints (CPCI-S收录EI收录) 会议论文 14th International Conference on Electronic Materials and Packaging, EMAP 2012, Lantau Island, Hong kong, December 13, 2012 - December 16, 2012 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/15 Brittle fracture  Brittleness  Failure modes  Morphology  Nickel  Tensile strength   Microstructural Evolution and Mechanical Behavior of Line-type Ni/Sn3.0Ag0.5Cu/Ni Interconnects with a Small Thickness during Isothermal Agin (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zeng, Jing-Bo[1];  Xu, Guang-Sui[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Dissolution Behavior of Cu UBM in BGA Structure Sn-3.0Ag-0.5Cu/Cu Joints during Liquid Isothermal Aging at and above the Solder's Melting Tem (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Zhou, Min-Bo[1];  Zeng, Jing-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering proc (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Anisotropy  Electronics packaging  Flip chip devices  Microstructure  Morphology  Soldering  Soldering alloys  Solidification  Undercooling   Effect of activators and surfactants in halogen-free fluxes on wettability of Sn-0.7Cu-0.05Ni solder on Cu substrate (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Li, Chang-Zheng[1];  Yan, Mo-Yang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Electronics packaging  Nickel  Soldering  Soldering alloys  Substrates  Surface active agents  Wetting   Influence of Pre-existing Void in the Solder Joint on Electromigration Behavior of Cu/Sn58Bi/Cu Joints (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:   收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Electromigraiton  Pre-existion void  Cu/Sn58Bi/Cu solder joint  Inhibittion effect  Crack