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Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via str (EI收录) 会议论文
Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013
作者:  Qin, Hong-Bo[1];  Yuwen, Hui-Hui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:8/0  |  提交时间:2019/04/15
Influence of Geometry of Microbump Interconnects on Thermal Stress and Fatigue Life of Interconnects in Copper Filled Through Silicon Via Str (CPCI-S收录) 会议论文
2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
作者:  Qin, Hong-Bo[1];  Yuwen, Hui-Hui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/15
QoS Multicast Routing problem Based on Artificial Fish-Swarm Algorithm (CPCI-S收录) 会议论文
PROCEEDINGS OF THE FIRST INTERNATIONAL WORKSHOP ON EDUCATION TECHNOLOGY AND COMPUTER SCIENCE, VOL II
作者:  Liu, Chun-bo[1];  Wang, Hui-jin[1];  Luo, Zhi-ping[2];  Yu, Xiu-qin[3];  Liu, Li-hua[4]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/17


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