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浏览/检索结果: 共17条，第1-10条 帮助 限定条件 发表日期：2012    内容类型：其他     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Investigation of a Unified LTCC-based Micromachining and Packaging Platform for High Density/Multifunctional Microsystem Integration 其他 2012-01-01 Miao, Min; Jin, Yufeng; Gan, Hua; Zhang, Jing; Qiu, Yunsong; Zhang, Yang; Zhang, Yangfei; Cao, Rui; Li, Zhensong; Wang, Zhengyi; Mu, Fangqing; Gao, Chengchen 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 THE INVESTIGATION OF 3D EMBEDDED MICROCHANNEL NETWORKS FOR 3D IC COOLING, VACUUM PACKAGING AND THZ PASSIVE DEVICE APPLICATIONS 其他 2012-01-01 Miao, Min; Zhang, Jing; Zhang, Yang; Han, Bo; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 CIRCUITS   A Thick Film Accelerometer based on L TCC-Technology 其他 2012-01-01 Guo, Shichao; Miao, Min; Fang, Runiu; Hu, Duwei; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 Accelerometer  LTCC  piezoresistive  simulation  Thick-film Process  LTCC  FABRICATION   Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection 其他 2012-01-01 Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Investigation of Cooling Performance of Micro-Channel Structure Embedded in LTCC Substrate for 3D Micro-System 其他 2012-01-01 Hu, Du-wei; Miao, Min; Ma, Sheng-lin; Fang, Ru-niu; Guo, Shi-chao; Jin, Yu-feng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16 Process Development and Characterization of BCB-based Redistribution Layer (RDL) for Silicon Interposer Application 其他 2012-01-01 Sun, Xin; Cui, Qinghu; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/16 A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding 其他 2012-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 Simulation-based Investigation in Effects of Design Parameters on Electrical Characters for a TSV-bump Combination 其他 2012-01-01 Fang, Runiu; Sun, Xin; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via 其他 2012-01-01 Miao, Min; Zhu, Yunhui; Bian, Yuan; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Fang, Runiu; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16 Parametric Study, Modeling of Etching Process and Application for Tapered Through-Silicon-Via 其他 2012-01-01 Ma, Shenglin; Zhong, Xiao; Bian, Yuan; Sun, Xin; Zhu, Yunhui; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16