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	Investigation of Cooling Performance of Micro-Channel Structure Embedded in LTCC Substrate for 3D Micro-System
	Hu, Du-wei ; Miao, Min ; Ma, Sheng-lin ; Fang, Ru-niu ; Guo, Shi-chao ; Jin, Yu-feng
	2012
英文摘要	The paper reports the design, fabrication and thermal property investigation of serpentine micro-channel structure embedded in Low Temperature Co-fired Ceramic (LTCC) substrate for thermal management of 3D micro-system. Serpentine micro-channel structure is about 2cm(length) x 2cm(width) x 2mm(thickness) in dimension and the micro-channel is about 200 mu mx200 mu m in its cross section. Infrared imaging is used to test temperature distribution of the whole LTCC substrate. Based on the test results, the cooling performance of the serpentine micro-channel is evaluated. With the present design of micro-channel, the experiment shows the maximum temperature of the substrate decreases from 85 C to 48 C as the flow rate of deionized (DI) water through the micro-channel ranges from 0.59ml/min to 2.48ml/min When the flow rate of DI water through micro-channel is increased with an increment of 0.5ml/min from 1.87ml/min, the decrease of maximum temperature of substrate is less than 2 degrees C.; Engineering, Electrical & Electronic; Physics, Applied; CPCI-S(ISTP); 0
语种	英语
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/405904]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Hu, Du-wei,Miao, Min,Ma, Sheng-lin,et al. Investigation of Cooling Performance of Micro-Channel Structure Embedded in LTCC Substrate for 3D Micro-System. 2012-01-01.

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