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浏览/检索结果: 共24条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   A Snake-like Robot Composed of 2-DOFs Modularized Spherical-shape Joints for Space Application (CPCI-S收录) 会议 作者:  Wang, Haomiao[1];  Liu, Tianliang[1];  Xu, Wenfu[1];  Wang, Hongtao[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Snake-like Robot  Hyper-redundant Manipulator  Bionic Robot  Bio-inspired Robot   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   Gait recognition based on 3D skeleton joints captured by kinect (EI收录) 会议 Phoenix, AZ, United states, 作者:  Wang, Yufei[2];  Sun, Jiande[1];  Li, Jing[1,3];  Zhao, Dong[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Gait analysis  Image processing  Musculoskeletal system   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature (CPCI-S收录) 会议 作者:  Jin, Hong;  Zhu, Jie-Fei;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Ag-plated Cu flakes  plating process  hybrid paste  sintered joints   Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议 作者:  Jiang, Han[1];  Liang, Shui-Bao[1];  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TSV  solder bump joint  thermal fatigue  size effect  finite element analysis   Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 micro-scale solder joint  creep deformation  current density  electro-thermo-mechanical coupled loads   Effect of Pb Content on Thermal Fatigue Life of Mixed SnAgCu-SnPb Solder Joints (CPCI-S收录) 会议 作者:  Wen Qiang[1,2];  Li Xunping[2];  Li Guoyuan[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/11 Mixed solder joints  Pb content  Thermal fatigue life   Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议 作者:  Li, Wang-Yun[1];  Cao, Shan-Shan[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 micro-scale solder joint  size effect  creep deformation  creep mechanism  fracture behavior