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合肥物质科学研究院 [21]

长春光学精密机械与物... [8]

兰州理工大学 [3]

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期刊论文 [40]

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2022 [41]

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发表日期：2022

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	Anomalous Lattice Evolution-Mediated Electrical Properties in Transparent KNN-Based Lead-Free Ferroelectric Films 期刊论文 INORGANIC CHEMISTRY, 2022 作者: Dai, Song; Xu, Liqiang; Han, Kun; Chen, Pingfan; Wang, Ke 收藏 \| 浏览/下载：20/0 \| 提交时间：2022/12/23
	Modulating mechanical performances of metallic amorphous materials through phase gradient 期刊论文 INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, 2022, 卷号: 234, 页码: 107680 作者: Guan, Yunlong; Wang YJ(王云江); Song, Weidong 收藏 \| 浏览/下载：27/0 \| 提交时间：2022/10/23 Metallic glasses Strength-ductility synergy Phase gradient Shear bands Molecular dynamics
	Dopant-free hole conductor with hybrid multisite passivation for perovskite solar cells 期刊论文 MATERIALS LETTERS, 2022, 卷号: 326 作者: Zhao, Chundie; Kong, Fantai; Chen, Shuanghong; Peng, Yaole; Zhang, Jinxue 收藏 \| 浏览/下载：16/0 \| 提交时间：2022/12/22 Hole transporting material Hybrid multisite passivation Solar energy materials Organic Perovskite solar cell
	Improved Solubility in Metavalently Bonded Solid Leads to Band Alignment, Ultralow Thermal Conductivity, and High Thermoelectric Performance in SnTe 期刊论文 ADVANCED FUNCTIONAL MATERIALS, 2022 作者: Liu, Yuqi; Zhang, Xuemei; Nan, Pengfei; Zou, Bo; Zhang, Qingtang 收藏 \| 浏览/下载：27/0 \| 提交时间：2022/12/22 band alignments materials designs metavalent bonding solubility limits thermoelectric
	Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者: Zhang, Ping; Zhang, Xian; Ding, Xin; Wang, Yanyan; Xiao, Chao 收藏 \| 浏览/下载：23/0 \| 提交时间：2022/12/23 Segregated structure Intermetallic compound Thermal conductivity Sliver interface layer
	Enhanced photoluminescence stability and internal defect evolution of the all-inorganic lead-free CsEuCl3 perovskite nanocrystals 期刊论文 PHYSICAL CHEMISTRY CHEMICAL PHYSICS, 2022, 卷号: 24 作者: Gao, Yalei; Zhang, Tao; Liu, Jun; Liu, Hongjun; Li, Meixian 收藏 \| 浏览/下载：17/0 \| 提交时间：2022/12/23
	In-situ electronic structure redistribution tuning of single-atom Mn/g-C3N4 catalyst to trap atomic-scale lead(II) for highly stable and accurate electroanalysis 期刊论文 JOURNAL OF HAZARDOUS MATERIALS, 2022, 卷号: 435 作者: Li, Yong-Yu; Song, Zong-Yin; Xiao, Xiang-Yu; Zhang, Long-Ke; Huang, Hong-Qi 收藏 \| 浏览/下载：17/0 \| 提交时间：2022/12/23 Mn single atom Electronic structure redistribution Valance cycles Atomic-scale Pb(II) Electroanalysis
	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：18/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Dion-Jacobson phase lead-free halide (PDA)MX4 (M¼Sn/Ge; X¼I/Br/Cl) perovskites: A first-principles theory 期刊论文 Journal of Solid State Chemistry, 2022, 卷号: 315, 期号: 2022, 页码: 123449 作者: Zhang,Xiaoxiao; Wang,Pingjian; Wu,Qingyu; Xu,Ling; Chen,Mingyu 收藏 \| 浏览/下载：13/0 \| 提交时间：2022/12/14
	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai; Chen, Bin; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：88/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions

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