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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Binary alloys  Brazing  Brazing filler metals  Grain size and shape  Intermetallics  Melting point  Microstructure  Nanoparticles  Synthesis (chemical)  Brazing joints  Composite solders  Crystal planes  Driving forces  Interfacial intermetallics  Liquidus temperature  Melting process  Melting properties   Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Copper alloys  Elastic moduli  Fracture  Fracture mechanics  Shear flow  Soldered joints  Surface analysis  Tin alloys  Area ratios  Fracture mechanisms  Fracture surface analysis  Fracture surfaces  Fractured surfaces  Isothermal aging  Lead-free solder joint  Solder joints   Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337 作者:  Ye, Chang-Sheng;  Ci, Wen-Juan;  Lin, Qiao-Li;  Sui, Ran;  Wang, Jian-Bin 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Binary alloys  Cobalt alloys  Copper alloys  Descaling  Free energy  Lead-free solders  Oxide films  Silicon  Silicon compounds  Silver alloys  Surface reactions  Ternary alloys  Tin  Wetting  Co-based alloys  Crystalline state  Sn-based solders  Surface free energy  Surface oxide films  Temperature range  Wetting balance methods  Wetting mechanism   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan 收藏  |  浏览/下载：16/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文 MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9 作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan 收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02 Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point   Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite 期刊论文 Materials, 2020, 卷号: 13, 期号: 7 作者:  Zhang, Yubin;  Liao, Xinjiang;  Lin, Qiaoli;  Mu, Dekui;  Lu, Jing 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Carbides  Graphite  Growth kinetics  Infiltration  Lead-free solders  Magnetic bubbles  Mass transfer  Reaction kinetics  Tin compounds  Vanadium compounds  Wetting  Apparent contact angle  Micro-structural characteristics  Micro-structural characterization  Porous graphite  Quasi-equilibrium state  Reactive infiltration  Reactive wetting  Three-phase contact line   Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond 期刊论文 Applied Surface Science, 2020, 卷号: 504 作者:  Liao, Xinjiang;  He, Qiqi;  Lin, Qiaoli;  Mu, Dekui;  Huang, Hui 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14 Adsorption  Binary alloys  Chemical bonds  Chemical vapor deposition  Lead-free solders  Reaction kinetics  Synthetic diamonds  Tin compounds  Wetting  Bonding techniques  Chemical vapour deposition  CVD Diamond  Interface reactions  Polycrystalline CVD diamond  Precursor films  Sessile drop method  Spreading kinetics   Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390 作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun 收藏  |  浏览/下载：114/0  |  提交时间：2020/12/16 LEAD-FREE SOLDERS  INTERMETALLIC COMPOUNDS  LIQUID SN  KINETICS  GROWTH  CU6SN5  METALLIZATION