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CORC

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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min
收藏  |  浏览/下载：77/0  |  提交时间：2021/02/02
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：131/0  |  提交时间：2021/02/02
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：22/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02
Cellulose Nanowhisker (CNW)/Graphene Nanoplatelet (GN) Composite Films With Simultaneously Enhanced Thermal, Electrical and Mechanical Properties 期刊论文
FRONTIERS IN MATERIALS, 2019, 卷号: 6, 页码: 11
作者:  Liu, Dongyan;  Dong, Yu;  Liu, Yueyue;  Ma, Na;  Sui, Guoxin
收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
收藏  |  浏览/下载：22/0  |  提交时间：2021/02/02

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