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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zhu, Yunhui[1];  Zeng, Qinghua[1];  Ma, Shenglin[1,2];  Su, Fei[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Low-frequency Testing of Through Silicon Vias for Defect Diagnosis in Three-dimensional Integration Circuit Stacking Technology (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Xu, Yichao[1,3];  Miao, Min[1,2];  Fang, Runiu[1];  Sun, Xin[1];  Zhu, Yunhui[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/12 Electrical Measurement and Analysis of TSV/RDL for 3D Integration (CPCI-S收录) 会议论文 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) 作者:  Sun, Xin[1];  Fang, Runiu[1];  Zhu, Yunhui[1];  Zhong, Xiao[1];  Bian, Yuan[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Investigation of a TSV-RDL In-line Fault-Diagnosis System and Test Methodology for Wafer-level Commercial Production (CPCI-S收录) 会议论文 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) 作者:  Fang, Runiu[1];  Miao, Min[2];  Sun, Xin[1];  Zhu, Yunhui[1];  Wang, Guanjiang[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/12 A TSV Last Integration Approach with Wafer Level Pre-patterned Adhesive Bonding (CPCI-S收录) 会议论文 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) 作者:  Zhu, Yunhui[1];  Ma, Shenglin[1];  Sun, Xin[1];  Cui, Qinghu[2];  Zhong, Xiao[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 Understanding Effect of Additives in Copper Electroplating Filling for Through Silicon Via (CPCI-S收录) 会议论文 2012 IEEE 11TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT-2012) 作者:  Miao, Min[1,2];  Zhu, Yunhui[1];  Bian, Yuan[1];  Sun, Xin[1];  Ma, Shenglin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 A New Method to Fabricate Sidewall Insulation of TSV Using a Parylene Protection Layer (CPCI-S收录) 会议论文 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009) 作者:  Ji, Ming[1,2];  Zhu, Yunhui[2];  Ma, Shenglin[2];  Sun, Xin[2];  Miao, Min[2,3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17