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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 A simultaneous enhancement of both strength and ductility by a novel differential-thermal ECAP process in Mg-Sn-Zn-Zr alloy 期刊论文 Journal of Alloys and Compounds, 2022, 卷号: 889 作者:  Zhou, Tianshui;  Zhang, Quanfa;  Li, Qianqian;  Wang, Lidong;  Li, Qinglin 收藏  |  浏览/下载：29/0  |  提交时间：2022/02/17 Ductility  Formability  Grain boundaries  Grain refinement  Grain size and shape  Magnesium alloys  Textures  Tin alloys  Zinc alloys  Zircaloy  Channel angular pressing  Differential thermals  Differential-thermal equal-channel angular pressing  ECAP processing  Equal channel angular  Mechanical  Prismaticslip  Property  Strength and ductilities  Zr alloys   Fabricate of High-Strength and High-Conductivity Cu-Cr-Si Alloys through ECAP-Bc and Aging Heat Treatment 期刊论文 MATERIALS, 2020, 卷号: 13, 期号: 7 作者:  Guo, Tingbiao;  Wang, Junjie;  Wu, Yibo;  Tai, Xiaoyang;  Jia, Zhi 收藏  |  浏览/下载：13/0  |  提交时间：2020/06/02 Cu-1Cr-0  2Si alloy  equal channel angular pressing (ECAP)  electron back-scattered diffraction (EBSD)  texture  mechanical properties  electrical conductivity   Effect of microstructure and temperature on oxidation behavior of pure copper 期刊论文 Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: 12, 页码: 147-150 作者:  Cao, Jun;  Ding, Yu-Tian;  Lu, Zhen-Hua;  Hu, Yong 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Atoms  Copper  Crystal atomic structure  Equal channel angular pressing  Grain boundaries  Grain size and shape  Pressing (forming)  X ray diffraction  Atomic packing  Close-packed planes  Copper oxidation  Copper surface  Crystal planes  Different structure  Diffusion rate  ECAP  Grain size  Internal energies  Low energies  Oxidation behaviors  Oxidation film  Oxidation rate  Oxidation rates  Oxygen atom  Polycrystalline copper  Pure copper  Temperature increase  Weight gain   Effect of microstructure and temperature on oxidation behavior of pure copper 期刊论文 Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: 12, 页码: 147-150 作者:  Cao, Jun;  Ding, Yu-Tian;  Lu, Zhen-Hua;  Hu, Yong 收藏  |  浏览/下载：15/0  |  提交时间：2022/02/17 Atoms  Copper  Crystal atomic structure  Equal channel angular pressing  Grain boundaries  Grain size and shape  Pressing (forming)  X ray diffraction  Atomic packing  Close-packed planes  Copper oxidation  Copper surface  Crystal planes  Different structure  Diffusion rate  ECAP  Grain size  Internal energies  Low energies  Oxidation behaviors  Oxidation film  Oxidation rate  Oxidation rates  Oxygen atom  Polycrystalline copper  Pure copper  Temperature increase  Weight gain