Effect of microstructure and temperature on oxidation behavior of pure copper

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	Effect of microstructure and temperature on oxidation behavior of pure copper
	Cao, Jun; Ding, Yu-Tian; Lu, Zhen-Hua; Hu, Yong
刊名	Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment
	2011-12-01
卷号	32 期号:12 页码:147-150
关键词	Atoms Copper Crystal atomic structure Equal channel angular pressing Grain boundaries Grain size and shape Pressing (forming) X ray diffraction Atomic packing Close-packed planes Copper oxidation Copper surface Crystal planes Different structure Diffusion rate ECAP Grain size Internal energies Low energies Oxidation behaviors Oxidation film Oxidation rate Oxidation rates Oxygen atom Polycrystalline copper Pure copper Temperature increase Weight gain
ISSN号	10096264
英文摘要	Oxidation rate of copper was studied by scanning electron-microscopy(SEM), X-ray diffraction(XRD) and oxidation weight gain experiment, and the effects of different structure, grain size of copper and temperature on oxidation rate were analyzed. The results show that the structure is the main factor to oxidation rate for copper, the interfacial energy of non-dense crystal plane (100) is high, in which atomic packing is relatively loose and the surface is rough in atomic-scales, and the oxidation film forms continuously on (100) plane with higher oxidation rate compared with that of close-packed plane (111). When temperature increases, the internal energy of copper surface increases, and copper atomics are activated to react with oxygen atoms. The diffusion rate of copper atomics in oxidation film increases and the oxidation rate is accelerate with increase of temperature. The copper sample after treated by equal-channel angular pressing (ECAP), the crystal plane (111) increases, grain size decreases and the oxidation rate decreases. It is argued that the grain boundary is not the main factor to the oxidation rate of copper, and the area of low energy crystal plane (111) increases leading the decrease of copper oxidation rate.
语种	中文
出版者	Editorial Office of Transactions of Materials, 18 Xueqing Road, Beijing, 100083, China
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/150164]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
作者单位	State Key Laboratory of Gansu Advanced Non-Ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, China
推荐引用方式 GB/T 7714	Cao, Jun,Ding, Yu-Tian,Lu, Zhen-Hua,et al. Effect of microstructure and temperature on oxidation behavior of pure copper[J]. Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment,2011,32(12):147-150.
APA	Cao, Jun,Ding, Yu-Tian,Lu, Zhen-Hua,&Hu, Yong.(2011).Effect of microstructure and temperature on oxidation behavior of pure copper.Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment,32(12),147-150.
MLA	Cao, Jun,et al."Effect of microstructure and temperature on oxidation behavior of pure copper".Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment 32.12(2011):147-150.