CORC

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CORC

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Modelling and grinding characteristics of unidirectional C-SiCs 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 6, 页码: 8314-8324
作者:  Qu, Shuoshuo;  Yao, Peng;  Gong, Yadong;  Yang, Yuying;  Chu, Dongkai
收藏  |  浏览/下载：20/0  |  提交时间：2022/07/01
Low-temperature UV irradiation of carbon/AgNWs counter electrodes for inexpensive flexible dye-sensitized solar cells 期刊论文
SOLAR ENERGY, 2021, 卷号: 230, 页码: 996-1003
作者:  Zheng, Boda;  Zhu, Qingsheng;  Shang, Jian Ku
收藏  |  浏览/下载：37/0  |  提交时间：2022/01/27
Fabrication of high-quality silver nanowire conductive film and its application for transparent film heaters 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2021, 卷号: 71, 页码: 221-227
作者:  Zheng, Boda;  Zhu, Qingsheng;  Zhao, Yang
收藏  |  浏览/下载：27/0  |  提交时间：2021/10/15
Nano-scale twinned Cu with ultrahigh strength prepared by direct current electrodeposition 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 758, 页码: 1-6
作者:  Li, Sujie;  Zhu, Qingsheng;  Zheng, Boda;  Yuan, Jie;  Wang, Xiaojing
收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02
Flexible silver nanowire transparent conductive films prepared by an electrostatic adsorption self-assembly process 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 期号: 7, 页码: 5802-5812
作者:  Zheng, Boda;  Zhu, Qingsheng;  Zhao, Yang
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, Qingsheng;  Zhang, Xian;  Li, Sujie;  Liu, Chunzhong;  Li, Cai-Fu
收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02
Preparation and Activation Mechanism of Pd Colloid with High Concentration and Performance 期刊论文
ACTA METALLURGICA SINICA, 2017, 卷号: 53, 期号: 4, 页码: 487-493
作者:  Qu Shuoshuo;  Zhu Qingsheng;  Gong Yadong;  Yang Yuying;  Li Caifu
收藏  |  浏览/下载：20/0  |  提交时间：2021/02/02
Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 2, 页码: 1184-1190
Ma, Huicai; Guo, Jingdong; Chen, Jianqiang; Wu, Di; Liu, Zhiquan; Zhu, Qingsheng; Shang, Jianku; Zhang, Li; Guo, Hongyan
收藏  |  浏览/下载：32/0  |  提交时间：2016/04/21
MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER 期刊论文
ACTA METALLURGICA SINICA, 2009, 卷号: 45, 期号: 8, 页码: 912-918
作者:  Wang Xiaojing;  Zhu Qingsheng;  Wang Zhongguang;  Shang Jianku
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02
Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy 期刊论文
ACTA METALLURGICA SINICA, 2007, 卷号: 43, 期号: 1, 页码: 41-46
作者:  Zhu Qingsheng;  Zhang Li;  Wang Zhongguang;  Wu Shiding;  Shang Jianku
收藏  |  浏览/下载：0/0  |  提交时间：2021/02/02

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