MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER

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	MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
	Wang Xiaojing 1; Zhu Qingsheng 1; Wang Zhongguang 1; Shang Jianku 1,2
刊名	ACTA METALLURGICA SINICA
	2009-08-11
卷号	45 期号:8 页码:912-918
关键词	Pb-free solder particle coarsening electric current
ISSN号	0412-1961
通讯作者	Wang Zhongguang(zhgwang@imr.ac.cn)
英文摘要	Coarsening of the microstructure in Sn-Ag-Cu (SAC) solder joints under current stressing was observed experimentally and modeled by a dislocation-creep model which incorporates the coarsening of second phase particles in lead-free solder alloys. Both the effects of electric current and strain-enhanced coarsening were considered in this model. The straining effect took into account of both the inelastic-strain history and hydrostatic constraint. The model describes well the evolution of the eutectic microstructure and the predictions of the model agree reasonably well with experimentally observed trends.
资助项目	National Basic Research Program of China[2004CB619306]
WOS研究方向	Metallurgy & Metallurgical Engineering
语种	英语
出版者	SCIENCE PRESS
WOS记录号	WOS:000269601400003
资助机构	National Basic Research Program of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/96202]
专题	金属研究所_中国科学院金属研究所
通讯作者	Wang Zhongguang
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Wang Xiaojing,Zhu Qingsheng,Wang Zhongguang,et al. MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER[J]. ACTA METALLURGICA SINICA,2009,45(8):912-918.
APA	Wang Xiaojing,Zhu Qingsheng,Wang Zhongguang,&Shang Jianku.(2009).MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER.ACTA METALLURGICA SINICA,45(8),912-918.
MLA	Wang Xiaojing,et al."MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER".ACTA METALLURGICA SINICA 45.8(2009):912-918.