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科研机构
华南理工大学 [70]
内容类型
会议论文 [42]
会议 [23]
期刊论文 [5]
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2016 [1]
2015 [1]
2014 [2]
2012 [1]
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专题:华南理工大学
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Cell evolution and compressive properties of styrene-butadiene-styrene toughened and calcium carbonate reinforced polystyrene extrusion foams with supercritical carbon dioxide (EI收录)
期刊论文
Journal of Applied Polymer Science, 2016, 卷号: 133
作者:
Jing, Xin[1]
;
Peng, Xiang-Fang[1]
;
Mi, Hao-Yang[1]
;
Wang, Yuan-Sheng[1]
;
Zhang, Shuidong[2]
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/04/24
Biomechanics
Blowing agents
Butadiene
Calcium
Carbon dioxide
Cells
Cytology
Extrusion
Foams
Mechanical properties
Nanoparticles
Polystyrenes
Porous materials
Styrene
Supercritical fluid extraction
Research of in situ modified PS-PVD thermal barrier coating against CMAS (CaO-MgO-Al2O3-SiO2) corrosion (EI收录SCI收录)
期刊论文
Ceramics International, 2015, 页码: 3163-3169
作者:
Song, Jinbing[1,2]
;
Zhang, Xiaofeng[1,3]
;
Deng, Chunming[1,2]
;
Deng, Changguang[1,2]
;
Liu, Min[1,2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/25
Aluminum
Coatings
Corrosion
Corrosion resistance
Heat resistance
Microstructure
Physical vapor deposition
Plasma spraying
Thermal barrier coatings
A large-scale screen for coding variants predisposing to psoriasis
期刊论文
NATURE GENETICS, 2014, 卷号: 46, 页码: 45-+
作者:
Tang, Huayang[1]
;
Jin, Xin[2,3]
;
Li, Yang[1]
;
Jiang, Hui[2]
;
Tang, Xianfa[1]
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2019/04/25
Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing (EI收录SCI收录)
期刊论文
Transactions of Nonferrous Metals Society of China (English Edition), 2014, 卷号: 24, 页码: 1619-1628
作者:
Yue, Wu[1]
;
Qin, Hong-Bo[1]
;
Zhou, Min-Bo[1]
;
Ma, Xiao[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/25
Electric resistance
Electromigration
Electron probe microanalysis
Finite element method
Plastic deformation
Accumulation of circulating advanced oxidation protein products is an independent risk factor for ischaemic heart disease in maintenance haemodialysis patients (SCI收录)
期刊论文
NEPHROLOGY, 2012, 卷号: 17, 页码: 642-649
作者:
Zhou, Qiugen[1]
;
Wu, Shengjie[1]
;
Jiang, Jianping[1]
;
Tian, Jianwei[1]
;
Chen, Jianghua[6]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/26
advanced oxidation protein product
continuous ambulatory peritoneal dialysis
haemodialysis
ischaemic heart disease
Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
microvoids
solder interconnect
electrical field
phase field simulation
Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Liang, Shui-bao[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/11
Kirkendall void
growth exponent
morphological evolution
cyclic loading
phase field cystal model
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录)
会议
作者:
Yue, Wu[1]
;
Zhou, Min-Bo[2,3]
;
Zhang, Xin-Ping[2,3]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
laser jet solder ball bonding
Sn-3.0Ag-0.5Cu solder ball
wettability
surface contamination
Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Intermetallics
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Packaging materials
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Thermal expansion
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