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浏览/检索结果: 共70条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Cell evolution and compressive properties of styrene-butadiene-styrene toughened and calcium carbonate reinforced polystyrene extrusion foams with supercritical carbon dioxide (EI收录) 期刊论文 Journal of Applied Polymer Science, 2016, 卷号: 133 作者:  Jing, Xin[1];  Peng, Xiang-Fang[1];  Mi, Hao-Yang[1];  Wang, Yuan-Sheng[1];  Zhang, Shuidong[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Biomechanics  Blowing agents  Butadiene  Calcium  Carbon dioxide  Cells  Cytology  Extrusion  Foams  Mechanical properties  Nanoparticles  Polystyrenes  Porous materials  Styrene  Supercritical fluid extraction   Research of in situ modified PS-PVD thermal barrier coating against CMAS (CaO-MgO-Al2O3-SiO2) corrosion (EI收录SCI收录) 期刊论文 Ceramics International, 2015, 页码: 3163-3169 作者:  Song, Jinbing[1,2];  Zhang, Xiaofeng[1,3];  Deng, Chunming[1,2];  Deng, Changguang[1,2];  Liu, Min[1,2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Aluminum  Coatings  Corrosion  Corrosion resistance  Heat resistance  Microstructure  Physical vapor deposition  Plasma spraying  Thermal barrier coatings   A large-scale screen for coding variants predisposing to psoriasis 期刊论文 NATURE GENETICS, 2014, 卷号: 46, 页码: 45-+ 作者:  Tang, Huayang[1];  Jin, Xin[2,3];  Li, Yang[1];  Jiang, Hui[2];  Tang, Xianfa[1] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/25 Electromigration induced microstructure evolution and damage in asymmetric Cu/Sn-58Bi/Cu solder interconnect under current stressing (EI收录SCI收录) 期刊论文 Transactions of Nonferrous Metals Society of China (English Edition), 2014, 卷号: 24, 页码: 1619-1628 作者:  Yue, Wu[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/25 Electric resistance  Electromigration  Electron probe microanalysis  Finite element method  Plastic deformation   Accumulation of circulating advanced oxidation protein products is an independent risk factor for ischaemic heart disease in maintenance haemodialysis patients (SCI收录) 期刊论文 NEPHROLOGY, 2012, 卷号: 17, 页码: 642-649 作者:  Zhou, Qiugen[1];  Wu, Shengjie[1];  Jiang, Jianping[1];  Tian, Jianwei[1];  Chen, Jianghua[6] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/26 advanced oxidation protein product  continuous ambulatory peritoneal dialysis  haemodialysis  ischaemic heart disease   Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 microvoids  solder interconnect  electrical field  phase field simulation   Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Liang, Shui-bao[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/11 Kirkendall void  growth exponent  morphological evolution  cyclic loading  phase field cystal model   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion