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浏览/检索结果: 共20条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 microvoids  solder interconnect  electrical field  phase field simulation   A Dual-Polarized Base-Station Antenna For LTE Communication System (CPCI-S收录) 会议 作者:  Guo, Xing-Xin[1];  Wen, Ding-Liang[1];  Chu, Qing-Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 dual-polarized antenna  wideband antenna  base-station antenna  LTE   A Broadband Dual-Polarized Antenna With Gamma-Shaped Feeding Structures (CPCI-S收录) 会议 作者:  Wen, Ding-Liang[1];  Chu, Qing-Xin[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 dual-polarized antenna  broadband antenna  stable radiation pattern  Gamma-shaped feeds   Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Liang, Shui-bao[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/11 Kirkendall void  growth exponent  morphological evolution  cyclic loading  phase field cystal model   Three principles of designing base-station antennas (EI收录) 会议 Hobart, TAS, Australia, 作者:  Chu, Qing-Xin[1];  Luo, Yu[1];  Wen, Ding-Liang[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Base stations  Frequency bands  Impedance matching (electric)  Polarization   One-pot synthesis of ordered mesoporous Cu-KIT-6 and its improved catalytic behavior for the epoxidation of styrene: Effects of the pH value (CPCI-S收录) 会议 作者:  Li, Baitao[1];  Luo, Xin[1];  Huang, Jing[1];  Wang, Xiujun[1];  Liang, Zhenxing[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Mesoporous material  KIT-6  Styrene epoxidation  pH-adjusting   Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 segregation  electromigration  Sn-Bi solder  interconnect  phase field simulation   Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议 作者:  Jiang, Han[1];  Liang, Shui-Bao[1];  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TSV  solder bump joint  thermal fatigue  size effect  finite element analysis   Influence of the zinc-oxide/salt content in the aluminum soldering flux on interfacial microstructure and mechanical property of Sn-0.7Cu/Al (CPCI-S收录) 会议 作者:  Chen, Guo-Liang[1,2];  Zhou, Min-Bo[1,2];  Zhang, Lang[1,2];  Lin, Yuan-Jiang[1,2];  Zhang, Yu-Peng[3] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 aluminum soldering  Sn-0.7Cu solder  interfacial microstructure  mechanical property  LED assembly   Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interc (CPCI-S收录) 会议 作者:  Liang, Shui-Bao;  Ke, Chang-Bo;  Tan, Meng-Ying;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 electromigration  microstructure evolution  phase segregation  Cu/Sn-Bi/Cu interconnect  phase field simulation