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浏览/检索结果: 共34条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulati (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 microvoids  solder interconnect  electrical field  phase field simulation   Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Liang, Shui-bao[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/11 Kirkendall void  growth exponent  morphological evolution  cyclic loading  phase field cystal model   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Effect of the Au bonding pad contamination on the wettability of Au/Sn-3.0Ag-0.5Cu/Au solder joints in flux-free laser jet solder ball bondin (CPCI-S收录) 会议 作者:  Yue, Wu[1];  Zhou, Min-Bo[2,3];  Zhang, Xin-Ping[2,3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 laser jet solder ball bonding  Sn-3.0Ag-0.5Cu solder ball  wettability  surface contamination   Highly stable and efficient platinum nanoparticles supported on TiO2@Ru-C: investigations on the promoting effects of the interpenetrated TiO (CPCI-S收录) 会议 作者:  Li, Zuopeng[1];  Guo, Yong[1];  Liu, Zhen[2];  Wu, Xin[2];  Zeng, Jianhuang[2] 收藏  |  浏览/下载：13/0  |  提交时间：2019/04/11 TiO2@Ru  stability  electrocatalysts  utilization efficiency   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录) 会议 作者:  Liang, Shui-Bao[1];  Ke, Chang-Bo[1];  Ma, Wen-Jing[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 segregation  electromigration  Sn-Bi solder  interconnect  phase field simulation   Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature (CPCI-S收录) 会议 作者:  Jin, Hong;  Zhu, Jie-Fei;  Zhou, Min-Bo;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Ag-plated Cu flakes  plating process  hybrid paste  sintered joints   Sneak-path Based Test for 3D Stacked One-Transistor-N-RRAM Array (CPCI-S收录) 会议 作者:  Zhang, Qiang[1];  Cui, Xiaole[1];  Xu, Xiaoyan[1];  Wang, Xin'an[1];  Ma, Zhi[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 RRAM  test technique  sneak-paths  resistance variation   Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder (CPCI-S收录) 会议 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 Phase field crystal model  Microstructure evolution  Microcrack propagation  Strain