CORC

在结果中检索

CORC

浏览/检索结果: 共22条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Robust Average Formation Tracking for Multi-Agent Systems With Multiple Leaders 其他
2017-01-01
作者:  Jin, Tao;  Liu, Zhi-Wei;  Zhou, Hong;  Guan, Zhi-Hong;  Qin, Yuzhen
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Robust Average Formation Tracking for Multi-Agent Systems With Multiple Leaders 其他
2017-01-01
作者:  Jin, Tao;  Liu, Zhi-Wei;  Zhou, Hong;  Guan, Zhi-Hong;  Qin, Yuzhen
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
A novel 0-3 kPa piezoresistive pressure sensor based on a shuriken-structured diaphragm 其他
2016-01-01
Guan, Taotao; Yang, Fang; Wang, Wei; Huang, Xian; Jiang, Boyan; He, Jun; Zhang, Li; Fu, Fengshan; Li, Dan; Li, Rui; Zhao, Qiancheng; Zhang, Dacheng
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
Evaluation and Optimization of Thermo-Mechanical Reliability of a TSV-based 3D MEMS 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Chen, Jing; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
A NOVEL 0-3 KPA PIEZORESISTIVE PRESSURE SENSOR BASED ON A SHURIKEN-STRUCTURED DIAPRAGM 其他
2016-01-01
Guan, Taotao; Yang, Fang; Wang, Wei; Huang, Xian; Jiang, Boyan; He, Jun; Zhang, Li; Fu, Fengshan; Li, Dan; Li, Rui; Zhao, Qiancheng; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices 其他
2016-01-01
Meng, Wei; Jin, Yufeng; Guan, Yong; Zeng, Qinghua; Hen, Jing C.
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Fabrication and Filling Quality Optimization of the High Density and Small Size Through Silicon Via Array for Three-dimensional Packaging 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging 其他
2016-01-01
Meng, Wei; Zeng, Qinghua; Guan, Yong; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer 其他
2016-01-01
Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Meng, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03

©版权所有 ©2017 CSpace - Powered by CSpace