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Numerical Simulation Research on Thermal Response Characteristics of E-type Coaxial Thermocouples 会议论文
长沙, 2021/09/12
作者:  Qi L(齐力);  Han GL(韩桂来);  Jiang ZL(姜宗林)
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/06
Thermal control design and analysis of a zoom TV optical mechanical system 会议论文
Xi'an, China, 2018-12-05
作者:  Zhang, Yue;  Shi, Kui;  Wang, Huan;  Zhang, Gaopeng;  Qu, Rui
收藏  |  浏览/下载：23/0  |  提交时间：2019/04/02
Mathematical Modeling and Optimal Design of Thermal Insulation Layers of A Ship Provision Cold-Storage Room 会议论文
作者:  Lei, Linxuan;  Mao, Xiaobing;  Song, Kai;  Li, Yuguang
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/05
Effect of Catalysts on Hydrothermal Preparation of BN nanostructures 会议论文
上海, 2018
作者:  Haixu Wang;  Guang Yang;  Ning Wang;  Rong Sun;  Chin-Ping Wong
收藏  |  浏览/下载：19/0  |  提交时间：2019/01/31
Comparison of Degradation Mechanisms and Aging Behaviors of Palm Oil and Mineral Oil during Thermal Aging 会议论文
作者:  Yan, Wei;  Yang, Liuqing;  Cui, Huize;  Ge, Zhao;  Li, Shijun
收藏  |  浏览/下载：108/0  |  提交时间：2019/11/19
Analysis on the performance of high insulation materials for current bending XLPE cable 会议论文
作者:  Yu, Xin;  Gao, Peng-Fei;  Gao, Nai-Kui;  Huang, Zhen;  Jin, Hai-Yun
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/19
Effects of nano-SiO2doping on tracking growth and thermal accumulation in silicone rubber insulation 会议论文
作者:  Nazir, M. Tariq;  Phung, B.T.;  Li, Shengtao
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/19
Vibration characteristics of thermal insulation tile with material and geometric nonlinear effects 会议论文
作者:  Zhao, Xinghong;  Xia, Wei;  Shen, Shengping
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/19
Triggered Characteristics of LTVS with Different Mixed Target Materials 会议论文
28th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2018, Greifswald, Germany, 2018-09-23
作者:  He, Weiliang;  Zhang, Jie;  Duan, Xiongying;  Jiang, Yi;  Liao, Minfu
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/02
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou
收藏  |  浏览/下载：71/0  |  提交时间：2018/04/25

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