High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology | |
Wang, Boxue1; Jia, Yangtao1; Zhang, Haoyu1; Jia, Shiyin1; Liu, Jindou1; Wang, Weifeng1; Liu, Xingsheng1,2 | |
2018 | |
会议日期 | 2018-01-30 |
会议地点 | San Francisco, CA, United states |
卷号 | 10513 |
DOI | 10.1117/12.2289259 |
英文摘要 | An insulation micro-channel cooling (IMCC) has been developed for packaging high power bar-based vertical stack and horizontal array diode lasers, which eliminates many issues caused in its congener packaged by commercial copper formed micro-channel cooler(MCC), such as coefficient of thermal expansion (CTE) mismatch between cooler and diode laser bar, high coolant quality requirement (DI water) and channel corrosion and electro-corrosion induced by DI water if the DI-water quality is not well maintained The IMCC cooler separates water flow route and electrical route, which allows tap-water as coolant without electro-corrosion and therefore prolongs cooler lifetime dramatically and escalated the reliability of these diode lasers. The thickness of ceramic and copper in an IMCC cooler is well designed to minimize the CTE mismatch between laser bar and cooler, consequently, a very low "SMILE" of the laser bar can be achieved for small fast axis divergence after collimation. In additional, gold-tin hard solder bonding technology was also developed to minimize the risk of solder electromigration at high current density and thermal fatigue under hard-pulse operation mode. Testing results of IMCC packaged diode lasers are presented in this report. © 2018 SPIE. |
产权排序 | 2 |
会议录 | Components and Packaging for Laser Systems IV |
会议录出版者 | SPIE |
语种 | 英语 |
ISSN号 | 0277786X |
ISBN号 | 9781510615113 |
内容类型 | 会议论文 |
源URL | [http://ir.opt.ac.cn/handle/181661/30042] |
专题 | 西安光学精密机械研究所_炬光科技有限公司 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
作者单位 | 1.Focuslight Technologies Inc., No. 56 Zhangba 6th Road, High-Tech Zone, Xi'an, Shaanxi; 710077, China 2.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, No. 17 Xinxi Road, Xi'an, Shaanxi; 710119, China |
推荐引用方式 GB/T 7714 | Wang, Boxue,Jia, Yangtao,Zhang, Haoyu,et al. High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology[C]. 见:. San Francisco, CA, United states. 2018-01-30. |
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