CORC

浏览/检索结果: 共18条,第1-10条 帮助

限定条件    
已选(0)清除 条数/页:   排序方式:
A Variety of Phase-Transition Behaviors in the Series of [tmenH_2][Ln(HCOO)_4]_2(Ln=Tb to Lu and Y) 其他
2016-01-01
Tian-Meng Zhao; Bing-Wu Wang; Zhe-Ming Wang; Song Gao
收藏  |  浏览/下载:3/0  |  提交时间:2017/12/03
Interposer Fabrication with Annular Copper TSV and Multi-layered Redistribution Layer 其他
2016-01-01
Guan, Yong; Ma, Shenglin; Zeng, Qinghua; Meng, Wei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:3/0  |  提交时间:2017/12/03
How multiple social networks affect user awareness: The information diffusion process in multiplex networks 其他
2015-01-01
Li, Weihua; Tang, Shaoting; Fang, Wenyi; Guo, Quantong; Zhang, Xiao; Zheng, Zhiming
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
Preparation and characterization of CMC-PVA/PVA-SA-MePc(COOH)8/CS-PVA bipolar membrane using electrospinning technique 其他
2013-01-01
Zhou, Ting Jin; Lu, Min; Chen, Ri Yao; 卢敏
收藏  |  浏览/下载:3/0  |  提交时间:2015/07/22
Effects of different substrate surface modifications on the epitaxial ZnO/Si 其他
2013-01-01
Wang, Peng; Jin, Changlian; Zhan, Huahan; Chen, Xiaohang; Xu, Fuchun; Zhou, Yinghui; Wang, Huiqiong; Kang, Junyong; 王鹏; 陈晓航; 周颖慧; 王惠琼; 康俊勇
收藏  |  浏览/下载:6/0  |  提交时间:2015/07/22
Development and application of three-dimension simulation engine in geological environment simulation with a case study in Yilin 其他
2012-01-01
Zhao, Yongan; Huang, Shutao; Wu, Lun; Tian, Yuan
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/17
Process Development and Characterization of BCB-based Redistribution Layer (RDL) for Silicon Interposer Application 其他
2012-01-01
Sun, Xin; Cui, Qinghu; Zhu, Yunhui; Ma, Shenglin; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/16
Phonon Modes in AlGaN Alloy with AlGaN/GaN MQW Interlayer 其他
2011-01-01
Zhou, Jin; Jin, Yufeng; Dai, Enguang; Yang, Zhijian; Shen, Bo
收藏  |  浏览/下载:6/0  |  提交时间:2015/11/16
Study on sodium montmorillonite modified by diallylmethyl alkyl ammonium bromide 其他
2010-01-01
Gao, Dangge; Ma, Jianzhong; Lu, Bin; Guo, Haiqing
收藏  |  浏览/下载:3/0  |  提交时间:2015/11/13
3D modeling and finite-element full-wave simulation of TSV for stack up SIP integration applications 其他
2010-01-01
Miao, Min; Liang, Lei; Li, Zhensong; Han, Bo; Sun, Xin; Jin, Yufeng
收藏  |  浏览/下载:2/0  |  提交时间:2015/11/13


©版权所有 ©2017 CSpace - Powered by CSpace