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科研机构
北京大学 [12]
太原师范学院 [1]
内容类型
其他 [13]
发表日期
2016 [2]
2015 [4]
2013 [1]
2012 [1]
2007 [1]
2006 [1]
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Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple
其他
2016-01-01
Guan, Yong
;
Zeng, Qinghua
;
Bian, Yuan
;
Zhong, Xiao
;
Chen, Jing
;
Ma, Shenglin
;
Zhu, Yunhui
;
Jin, Yufeng
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2017/12/03
3D packaging
fine pitch TSV
micro heater
thermocouple
quality evaluation
THROUGH-SILICON VIAS
STACKING TECHNOLOGY
LINER
Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs
其他
2016-01-01
Zeng, Qinghua
;
Chen, Jing
;
Jin, Yufeng
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
Investigation of stress rupture properties of micro beams using the piezoresistive effect
其他
2015-01-01
Guan, Taotao
;
Yang, Fang
;
Wang, Wei
;
Huang, Xian
;
He, Jun
;
Zhang, Li
;
Fu, Fengshan
;
Li, Rui
;
Zhang, Dacheng
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2017/12/03
Quality evaluation and simulation of through-multilayer TSV integration process for memory stacking
其他
2015-01-01
Guan, Yong
;
Zeng, Qinghua
;
Chen, Jing
;
Jin, Yufeng
;
Ma, Shenglin
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2017/12/03
Investigation of Stress Rupture Properties of Micro Beams using the Piezoresistive Effect
其他
2015-01-01
Guan, Taotao
;
Yang, Fang
;
Wang, Wei
;
Huang, Xian
;
He, Jun
;
Zhang, Li
;
Fu, Fengshan
;
Li, Rui
;
Zhang, Dacheng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2017/12/03
cross-beam structure
stress rupture properties
piezoresistive effect
FEM
mechanical testing
Quality Evaluation and Simulation of Through-Multilayer TSV Integration Process for Memory Stacking
其他
2015-01-01
Guan, Yang
;
Zeng, Qinghua
;
Chen, Jing
;
Jin, Yufeng
;
Ma, Shenglin
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2017/12/03
Through Silicon Via(TSV)
Memory Stacking
Bonding Strength
Thermodynamic Sinmlation
Anchor design for microdevice fabricated by silicon-on-glass process based on bonding strength consideration
其他
2013-01-01
He, Jun
;
Yang, Fang
;
Zhao, Danqi
;
Huang, Xian
;
Wang, Wei
;
Zhang, Dacheng
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2015/11/13
Parametric Study, Modeling of Etching Process and Application for Tapered Through-Silicon-Via
其他
2012-01-01
Ma, Shenglin
;
Zhong, Xiao
;
Bian, Yuan
;
Sun, Xin
;
Zhu, Yunhui
;
Chen, Jing
;
Miao, Min
;
Jin, Yufeng
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2015/11/16
Spatial distribution and temporal variation of ecological capital and their relation to climate change and the changes of land use and land cover on the northern slope of the Tianshan Mountain, China - art. no. 66790J
其他
2007-01-01
Zhang, Qing
;
Chen, Xiuwan
;
Gao, Wei
;
Zhang, Xianfeng
;
Zhou, Kefa
;
Wang, Xinli
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2015/11/13
ecological capital
climate change
land use
land cover
A 4 �� 4 tin oxide gas sensor array with surface micro-machined convex micro-hotplates
其他
2006-01-01
Guo, Bin
;
Bermak, Amine
;
Chan, Philip C.H.
;
Yan, Gui-Zhen
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/13
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