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CORC

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Achieving structural rejuvenation in metallic glass by modulating beta relaxation intensity via easy-to-operate mechanical cycling 期刊论文
INTERNATIONAL JOURNAL OF PLASTICITY, 2022, 卷号: 157, 页码: 103402
作者:  Zhang, L. T.;  Wang YJ(王云江);  Pineda, E.;  Yang, Y.;  Qiao, J. C.
收藏  |  浏览/下载：20/0  |  提交时间：2022/10/23
Cyclic oxidation behavior of a multilayer composite coating for single-crystal superalloys 期刊论文
CORROSION SCIENCE, 2018, 卷号: 145, 页码: 26-34
作者:  Ren, P;  Yang, YF;  Li, W;  Zhu, SL;  Wang, FH
收藏  |  浏览/下载：41/0  |  提交时间：2018/12/25
Mechanically Robust Atomic Oxygen-Resistant Coatings Capable of Autonomously Healing Damage in Low Earth Orbit Space Environment 期刊论文
ADVANCED MATERIALS, 2018, 卷号: 30, 期号: 36, 页码: -
作者:  Wang, XH;  Li, YX;  Qian, YH;  Qi, H;  Li, JQ
收藏  |  浏览/下载：23/0  |  提交时间：2018/12/25
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
Constructing hierarchical porous carbon via tin punching for efficient electrochemical energy storage 期刊论文
CARBON, 2018, 卷号: 134, 页码: 391, 397
作者:  Wang, Peng;  Xu, Jijian;  Xu, Feng;  Zhao, Wei;  Sun, Peng
收藏  |  浏览/下载：19/0  |  提交时间：2018/12/28
Transport properties of MnTe films with cracks produced in thermal cycling process 期刊论文
SPRINGER, 2017, 卷号: 123, 期号: 10, 页码: -
作者:  Yang, Liang;  Wang, Zhenhua;  Zhang, Zhidong;  Wang, ZH (reprint author), Univ Chinese Acad Sci, Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：14/0  |  提交时间：2018/01/10
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 9, 页码: 9748-9754
Ma, HC; Guo, JD; Chen, JQ; Wu, D; Liu, ZQ; Zhu, QS; Zhang, L; Guo, HY
收藏  |  浏览/下载：22/0  |  提交时间：2016/12/28

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