中国开放科研知识云: 检索

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	Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文 17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16 作者: Lu, Yao; Nie, Zhiqiang; Zhang, Pu; Wang, Zhenfu; Xiong, Lingling 收藏 \| 浏览/下载：39/0 \| 提交时间：2016/11/22 Computer simulation Electronics packaging High power lasers Numerical models Occupational risks Optical properties Packaging Power semiconductor diodes Shear stress Thermal stress
	Analysis of Factors Influencing the Accession to the GPA 会议论文 International Conference on Education, Management, Computer and Society (EMCS), 2016-01-01 作者: Yang, Gao[1] 收藏 \| 浏览/下载：5/0 \| 提交时间：2019/04/26 GPA Government Procurement Logit Model Probit Model Influential Factors
	Research on Competence of Township Level Petition Officers in Luoyang City 会议论文 2016 23RD ANNUAL INTERNATIONAL CONFERENCE ON MANAGEMENT SCIENCE & ENGINEERING, VOLS. I AND II, 2016-01-01 作者: Cheng Cheng; Luo Li; Wang Yi-lin 收藏 \| 浏览/下载：4/0 \| 提交时间：2019/12/30 petition work competence features job performance influential factors

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