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Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载:39/0  |  提交时间:2016/11/22


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