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Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02
Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文
Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin
收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
The Measurement of Optical Interconnect Module Postsoldering Alignment Offsets and the Study of Its Influence on Optical Coupling Efficiency 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: Vol.9 No.2, 页码: 380-387
作者:  Huang, Chunyue;  Lu, Liangkun;  Shao, Liangbin;  Liang, Ying
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/13
Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer 期刊论文
MATERIALS, 2017, 卷号: 10, 期号: 4, 页码: -
Zhang, Liang; Liu, Zhi-quan; Yang, Fan; Zhong, Su-juan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
Initial thermal stress and strain effects on thermal mechanical stability of through silicon via 期刊论文
MICROELECTRONIC ENGINEERING, 2016
Sun, Yunna; Sun, Shi; Zhang, Yazhou; Luo, Jiangbo; Wang, Yan; Ding, Guifu; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Reflow soldering optimization by using adaptive Kriging-HDMR method 期刊论文
Soldering & Surface Mount Technology, 2016, 卷号: Vol.28 No.2
作者:  Liming Chen;  Enying Li;  Hu Wang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/31
Time-based reflow soldering optimization by using adaptive Kriging-HDMR method. 期刊论文
Soldering & Surface Mount Technology, 2016, 卷号: Vol.28 No.2, 页码: 101-113
作者:  Chen, Liming;  Li, Enying;  Wang, Hu
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/31

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