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浏览/检索结果: 共1条，第1-1条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文 ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China Cui J.; Zhao J.; Fan Z.; Zhao C.; Bi Y.; Zhang J.; Niu G.; Shi Z.; Pei B.; Zhang G.; Xue Y.; Qi Y. 收藏  |  浏览/下载：14/0  |  提交时间：2013/03/25 The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting  when the cutting velocity equals 100mm/min  while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth  double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow  rapid cutting speed  the cutting quality meets the expecting demand.  fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power  using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence  a /4 waveplate to compensate heat -induced birefraction  utilize the Nd:YAG self- aperture effect  more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens  double axis linear step motor positioning system  suitable beam expander multiplying factor  appropriate diameter of exit beam aperture  proper repetition rate  when the cutting velocity equals 400mm/min  0.75mm thick silicon wafer can be penetrated