CORC

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CORC

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Size- and temperature-dependent thermal transport across a Cu-diamond interface: Non-equilibrium molecular dynamics simulations 期刊论文
SURFACES AND INTERFACES, 2023, 卷号: 37, 页码: 102736
作者:  Huang, Hai;  Zhong, Yinghui;  Cai, Bin;  Wang, Jiefang;  Liu, Zhongxia
收藏  |  浏览/下载：13/0  |  提交时间：2023/06/15
Role of interface on irradiation damage of Cu-diamond composites using classical molecular dynamics simulations 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 12, 页码: 16813-16824
作者:  Jin, Yanan;  Huang, Hai;  Zhong, Yinghui;  Yuan, Xiaoting;  Li, Huan
收藏  |  浏览/下载：20/0  |  提交时间：2022/08/22
Formation and Performance of Diamond (111)/Cu Interface from First-Principles Calculation 期刊论文
COATINGS, 2022, 卷号: 12, 期号: 5
作者:  Zhao, Yongsheng;  Yan, Fengyun;  An, Yi
收藏  |  浏览/下载：25/0  |  提交时间：2022/06/21
Wetting of molten cerium on typical carbon materials (graphite, CVD-diamond and NWCNT) and molten Cu-Ce alloys on graphite at 950 degrees C 期刊论文
JOURNAL OF RARE EARTHS, 2021, 卷号: 39, 期号: 3, 页码: 331-339
作者:  Sui, Ran;  Lin, Qiaoli;  Wang, Le;  Yang, Fan
收藏  |  浏览/下载：2/0  |  提交时间：2021/04/12
Thermal CVD growth of graphene on copper particles targeting tungsten-copper composites with superior wear and arc ablation resistance properties 期刊论文
DIAMOND AND RELATED MATERIALS, 2020, 卷号: 104
作者:  Dai, Dan;  Wu, Mingliang;  Shu, Shengcheng;  Yang, Ke;  Lin, Cheng-Te
收藏  |  浏览/下载：66/0  |  提交时间：2020/12/16
Construction of 3D interconnected diamond networks in Al-matrix composite for high-efficiency thermal management 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2020, 卷号: 380
作者:  Zhang, Long;  Wei, Qiuping;  An, Junjie;  Ma, Li;  Zhou, Kechao
收藏  |  浏览/下载：76/0  |  提交时间：2020/12/16
Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy 期刊论文
DIAMOND AND RELATED MATERIALS, 2019, 卷号: 97
作者:  Li, Mian;  Chen, Jinchang;  Lin, Qiaoli;  Wu, Yueqin;  Mu, Dekui
收藏  |  浏览/下载：15/0  |  提交时间：2019/11/15
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05
Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study 期刊论文
Carbon, 2018, 卷号: 127, 页码: 548-556
作者:  Pu JB(蒲吉斌);  Pu JB(蒲吉斌);  Liu, Zengjia;  Zheng, Shaoxian;  Lu ZB(鲁志斌)
收藏  |  浏览/下载：23/0  |  提交时间：2018/06/20
Thermal conductivity and mechanical properties of flake graphite/copper composite with a boron carbide-boron nano-layer on graphite surface 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2018, 卷号: 106, 页码: 42-51
作者:  Lv, D. J.;  Bai, H.;  Xue, C.;  Lyu, J. L.;  Li, J.
收藏  |  浏览/下载：25/0  |  提交时间：2018/12/04

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