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浏览/检索结果: 共8条，第1-8条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Highly Efficient 'composite Barrier Wall' Consisting of Concentrated Graphene Oxide Nanosheets and Impermeable Crystalline Structure for Poly(lactic acid) Nanocomposite Films (EI收录) 期刊论文 Industrial and Engineering Chemistry Research, 2016, 卷号: 55, 页码: 9544-9554 作者:  Huang, Hua-Dong[1,2];  Zhou, Sheng-Yang[1];  Zhou, Dong[1];  Ren, Peng-Gang[3];  Xu, Jia-Zhuang[1] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/24 Amorphous films  Bridge decks  Characterization  Composite films  Crystalline materials  Gas permeable membranes  Graphene  Lactic acid  Nanocomposites  Nanosheets  Oxide films  Packaging materials   Comparison of hydroxypropyl and carboxymethyl guar for the preparation of nanocellulose composite films (EI收录) 期刊论文 Cellulose, 2016, 卷号: 23, 页码: 2989-2999 作者:  Dai, Lei[1,2];  Long, Zhu[1,3];  Zhao, Yu[1,3];  Wang, Bin[3];  Chen, Jie[1,3] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Cellulose  Cellulose films  Film preparation  Gas permeable membranes  Hydrogen bonds  Nanocomposite films  Packaging materials  Scanning electron microscopy  Tensile strength  Thermogravimetric analysis   Three-dimensional nanoporous gold-cobalt oxide electrode for high-performance electroreduction of hydrogen peroxide in alkaline medium (EI收录SCI收录) 期刊论文 Journal of Power Sources, 2015, 卷号: 294, 页码: 136-140 作者:  Li, Zhihao[1];  He, Yanghua[1];  Ke, Xi[1];  Gan, Lin[3];  Zhao, Jie[4] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/25 Annealing  Catalyst activity  Charge transfer  Chronoamperometry  Cobalt  Cyclic voltammetry  Electrodes  Electrolytic reduction  Gold  Hydrogen peroxide  Nanosheets  Nickel  Oxidation  Oxide films  Peroxides  Porosity  Porous materials  Scanning electron microscopy  Tin  X ray diffraction   Preparation and characterization of solution-processed MWCNT/Ag matrix composite films (EI收录) 会议 Changsha, China, 作者:  Li, Jianping[1];  Li, Yanni[1];  He, Hu[1];  Wang, Fuliang[1] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/11 Agglomeration  Electric properties  Electronics packaging  Film preparation  Films  Metallic matrix composites  Multiwalled carbon nanotubes (MWCN)  Polymer blends  Pressure  Silver  Sintering  Thin films   Preparation, structure and properties of high performance silver-filled UV-curable polyurethane acrylate conductive inks (EI收录) 会议论文 Applied Mechanics and Materials, Tianjin, China, November 23, 2013 - November 25, 2013 作者:  Chen, Guang Xue[1];  Cui, Yan Yan[1,2];  Yang, Yu[1];  Wang, Qing[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Conductive films  Curing  Esters  Film preparation  Hydrates  Metal nanoparticles  Packaging machines  Polyethylene glycols  Polyurethanes   Model of N-type polycrystalline silicon thin film transistors under DC bias stress (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  He, Hongyu[1,2];  Zheng, Xueren[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/16 Dangling bonds  Degradation  Electronics packaging  Packaging  Polysilicon  Semiconducting silicon compounds  Thin film transistors  Thin films   Dielectric properties of Ag@SiO2/epoxy composite for embedded capacitor applications (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Liang, Xianwen[1,2,3];  Yua, Shuhui[1];  Luo, Suibin[1,2,3];  Zhuang, Zhiqiang[2,3];  Rong, Sun[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/16 Coatings  Composite films  Electronics packaging  Epoxy resins  Packaging  Permittivity  Silicon compounds  Solvents  Synthetic resins  Tanning   Effects of design, structure and material on thermal-mechanical reliability of large array wafer level packages (EI收录) 会议论文 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, Beijing, China, August 10, 2009 - August 13, 2009 作者:  Varia, Bhavesh[1];  Fan, Xuejun[1,2];  Han, Qiang[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/17 Computer crime  Copper  Copper smelting  Materials properties  Packaging  Polymer films  Polymers  Reconstruction (structural)  Reliability  Semiconducting silicon compounds  Silicon wafers  Spheres  Structural design  Technology  Thermomechanical treatment  Three dimensional