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CORC

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A study on the oxygen plasma treatment on the peel adhesion strength and solder wettability of SnBi58 based anisotropic conductive films 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Zhang, Shuye;  Huang, Mingliang;  Wu, Yang;  Yang, Ming;  Lin, Tiesong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Ji, Shengnan;  Ma, Haitao;  Wang, Chen;  Zhao, Ning;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-electrode 会议论文
19th International Conference on Electronic Packaging Technology
作者:  Ma HT(马海涛);  Zhao N(赵宁);  Wang YP(王云鹏)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective back-electrode 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Ji, Shengnan;  Wang, Chen;  Wang, Yunpeng;  Ma, Haitao;  Zhao, Ning
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 383-391
作者:  Zhang, Shuye;  Yang, Ming;  Wu, Yang;  Du, Jikun;  Lin, Tiesong
收藏  |  浏览/下载：20/0  |  提交时间：2019/12/02
Effects of Stirring Speed on Composition and Morphology of Non-cyanide Co-electroplating Au-Sn Thin Films 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Liu, Yawei;  Huang, Mingliang;  Huang, Feifei;  Zhao, Ning
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/09
Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips 期刊论文
MATERIALS SCIENCE AND TECHNOLOGY, 2012, 卷号: 28, 页码: 837-843
作者:  Huang, M. L.;  Pan, J. L.;  Ma, H. T.;  Zhao, N.
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/13
Interfacial reaction between Au and Sn films electroplated for LED bumps 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 卷号: 22, 页码: 193-199
作者:  Huang, M. L.;  Liu, Y.;  Gao, J. X.
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/18
Properties of TiN Films Deposited by Atomic Layer Deposition for Through Silicon Via Applications 会议论文
11th International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), Xian, PEOPLES R CHINA, 2010-01-01
作者:  Zhang, Wenjie;  Cai, Jian;  Wang, Dejun;  Wang, Qian;  Wang, Shuidi
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/24
Sequential Non-cyanide Electroplating Au/Sn/Au Films for Flip Chip-LED Bumps 会议论文
International Conference on Electronic Packaging Technology & High Density Packaging, Beijing, PEOPLES R CHINA, 2009-08-10
作者:  Liu, Yang;  Huang, Mingliang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/24

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