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	A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature
	Zhang, Shuye; Yang, Ming; Wu, Yang; Du, Jikun; Lin, Tiesong; He, Peng; Huang, Mingliang; Paik, Kyung-Wook
刊名	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
	2018
卷号	8页码:383-391
关键词	Anisotropic conductive film high reliability Sn-3Ag-0.5Cu solder thermal compression bonding
ISSN号	2156-3950
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3272124
专题	大连理工大学
作者单位	1.Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Heilongjiang, Peoples R China. 2.Yik Shing Tat Ind Co Ltd, Shenzhen 518101, Peoples R China. 3.Dalian Univ Technol, Dept Mat Sci & Engn, Dalian 116024, Peoples R China. 4.Guangzhou Med Univ, Dept Clin Lab, Shenzhen Shajing Hosp, Shenzhen 518104, Peoples R China. 5.Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Daejeon 34141, South Korea.
推荐引用方式 GB/T 7714	Zhang, Shuye,Yang, Ming,Wu, Yang,et al. A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8:383-391.
APA	Zhang, Shuye.,Yang, Ming.,Wu, Yang.,Du, Jikun.,Lin, Tiesong.,...&Paik, Kyung-Wook.(2018).A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8,383-391.
MLA	Zhang, Shuye,et al."A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 degrees C Bonding Temperature".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8(2018):383-391.

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